Fresh hacks every day
SMD components may be a little challenging for the home builder – even though the’re inordinately practical for homebrew PCBs – but if you play around with electronics and solder long enough, you’re eventually going to run into the horrors of BGA parts. Instead of convenient pins, BGA parts have tiny metallic balls on which solder is applied, a board … Read the rest
Okay, we think it’s questionable when people say they have no problem soldering QFN packages, but BGA? Granted this chip has far fewer balls on it than many, but it’s still quite impressive that [Xevel] was able to solder this BGA breakout by hand.
The chip you see above is a TMP006 infrared temperature sensor from TI. [Xevel] picked … Read the rest
In an effort to ease the process of soldering Ball Grid Array (BGA) chips at home [Roger] rigged up a hands-free solution for his hot air equipment.
The main component in the build is an Aoyue hot air rework station that he already had in his workshop. He wanted an adjustable mount that would hold it steady when reflowing parts … Read the rest
Having just received a shiny set of PCBs from the fab-house [Devbisme] needed a way to solder the main chip in place. It has a Ball-Grid Array footprint which is notoriously difficult to populate in a home lab. But he makes it look pretty easy and decided to share a video tutorial of the process.
The main tool he … Read the rest
Personally we find this Ball-Grid Array chip-swap rather horrifying. But if you want to beef up the processor on your 701 Eee PC this is what you’ll need to go through. Not only did [Red Fathom] upgrade to a 1.6 GHz chip, but he managed to get the computer to boot up with the new hardware in place.
BGAs … Read the rest
[Andrew Zonenberg] has crossed a line in his electronic hobby projects. The Ball Grid Array (BGA) is a type of chip footprint which most hobbyists leave to the professionals. But he’s learned the skills necessary to use them in his projects. Recently he ran a test batch to show off his soldering process and illustrate one of the errors a … Read the rest
[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the test boards are being assembled in his basement. Of the first lot of four boards, only one is functional. So he’s setting out to rework the … Read the rest
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