Ditch that old toaster oven and move to the next level of surface mount soldering with this vapor phase reflow method. [Ing.Büro R.Tschaggelar] put together this apparatus to use vapor phase reflow at his bench instead of sending out his smaller projects for assembly. It uses the heating element from an electric tea kettle to boil Galden HT 230 inside of a Pyrex beaker. There’s a copper heat break part way up the beaker to condense the chemical and keep it from escaping. When a populated board is lowered into the heated chamber, the solder paste reflows without the need to stress the components with unnecessary heat. Better than traditional reflow? At this level it’s hard to say, but we do find his method quite interesting.