Printing circuitry on a RepRap

Over on the RepRap blog, [Rhys] has been experimenting with molten metal to build circuits with the RepRap.

Last June, [Rhys] found a neat alloy made of Tin, Bismuth, and a little bit of Indium that melts at around 130° C, and has just the right properties to be extruded with a standard RepRap setup. The results were encouraging, but the molten metal quickly dissolved the brass and aluminum nozzles [Rhys] was pushing liquid metal through.

The solution to this problem was solved by anodizing the heck out of a RepRap nozzle to make a hard, protective oxide layer. Already [Rhys] has logged hundreds of hours squirting molten metal out of his RepRap with no signs of any damage to the nozzle.

Since [Rhys] figured out how to print in metal, he whipped up an extremely minimal Sanguino board. You can see this RepRapped PCB running a LED blink program after the break. Now to work on the RepRap pick and place…

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Xerox ink will print circuits


Xerox has announced a breakthrough in printable circuits. They’ve developed a conductive ink called “silver bullet” that can be printed on many different types of substrate to create circuits. The key part of the new ink is its lower melting point. Plastic film substrate melts at 150 degrees Celsius but the ink is liquid when ten degrees cooler to avoid damaging the film. This begs the question: how do you then solder components to the circuit?

The benefits of printable circuitry are obvious. Aside from cheaper and easier RFID, disposable circuits like greeting cards, and fabric-based electronics, we’re hoping this will facilitate more environmentally friendly PCB fabrication. That really depends on the ink’s production process and the resilience of the resulting circuitry.

[via Gizmodo]