If you do a lot of SMD soldering, a reflow oven is the fastest and most efficient way to get all those tiny components attached to your PCB. [Frank Zhao] saw the reflow ovens we featured here over the last few weeks and figured he might as well show off his rig as well. We’re certainly glad he did, because his very thorough writeup is a great stepping stone for anyone looking to construct a reflow oven of their own.
Like many others, he started off with a used toaster oven, modifying it to be controlled directly via the power cable rather than the oven’s dials. He built a small PCB to regulate the oven, which features an ATmega32u4 and thermocouple to keep the temperature in check. Control of the heating element is done using a solid state relay, for which he built his own heatsink.
He studied the reflow profile of the solder he would be using, programming the microcontroller to regulate the heating/cooling process without requiring any user input, aside from turning the oven on.
Check out the video below to see a brief overview of his system, and be sure to swing by his writeup to take a look at all the build details. There are a handful of additional videos along with plenty of pictures there, walking through each step of the process.
Continue reading “A very detailed reflow oven build”
[Eberhard] wanted his own reflow oven but didn’t really want to mess around with the internals that control the heating element. He put his microcontroller programming experience to work and came up with an add-on module that controls the oven by switching the mains power.
The image above shows a board in the midst of the reflow process. If you’re not familiar, solder paste usually comes with a recommended heat curve for properly melting the slurry. [Eberhard] managed to fit three of these temperature profiles into his firmware.
The ATtiny45 which makes up the controller samples oven temperature via the thermistor seen next to the board. A PID algorithm is used to calculate when to switch mains power on and off via a relay. One button and one LED make up the controller’s user interface for scrolling through the three preprogrammed temperature profiles.
It looks like it works great, see for yourself in the clip after the break.
Continue reading “Toaster oven reflow control without modifying the oven”
[Sebastian] needed a small solder oven so he bought himself a small toaster oven (Spanish, Google Translate). It’s not the kind of thing we’d make our breakfast in now, but for soldering it’s a very nice oven.
After a little bit of research on Google, [Sebastian] discovered that the best technique when dealing with reflow ovens and solder paste is following a specific temperature curve. Ideally, Tin/Lead solder needs to preheat from room temperature to 150 degrees C, then level off so the flux can activate. After that, a quick jaunt above 183 degrees C makes the solder flow. To get his toaster working optimally, [Sebastian] stuck a thermistor in the toaster and measured the temperature profiles of different ‘modes.’
The correct temperature curve was calculated using different heater elements and [Sebastian] was off to the races. He did have a few problems on his first few boards – solder bridging, mostly – but that’s not the fault of the oven. An LCD display (translate) was added recently so accurate real-time temperature monitoring is available.
[Thice] had himself a problem. As luck would have it his HP laser printer died shortly after the warranty period expired, and HP was ready to charge him €350 to repair it. Since that would pretty much buy [Thice] a new one, he decided to try fixing the problem himself. He scoured the Internet for a solution to his problem, and luckily discovered that his printer might be recoverable.
The entire LaserJet M1522 series is apparently pretty prone to breaking, with the formatter board being the usual point of failure. To fix his printer, he disassembled the outer shell, removing the formatter board from the unit. Once the onboard battery was removed, he constructed a set of standoffs using aluminum foil, and set the board in his oven at 180°C (~356°F) for about eight minutes.
After cooling, he reinstalled the board, and his printer behaved as good as new. [Thice] says that the only problem with his fix is that he needs to bake the board every 6 months or so, making this a great hack but not the most ideal solution in the long term.
For SMD work, solder paste and a heat gun is great. Heat guns aren’t the cheapest thing, so [Karel] decided to make cheap reflow oven out of a toaster oven. With a PCB taken from a laminator temperature control board, the build was fairly successful, so [Karel] decided to add a thermistor to his oven.
There was a problem with placing this thermistor near the board: solder melts in a reflow oven, so [Karel] needed to figure how to connect the thermistor to the control board outside the oven. The solution was crimping thin copper tubing to the thermistor leads and passing that tube through the wall of the oven. Epoxy was used to avoid an electrical short. A low tech solution, but very effective. After applying some solder paste and going in the oven, this board looks very clean. There are a few solder bridges, but nothing a wick can’t take care of.
[Karel] is now working on an update to the temperature controller that controls the oven over a serial connection. Check out the video of a few temperature cycles after the break.
Continue reading “Toaster oven forgoes Pop-Tarts, reflows solder”
Need to use that antiquated hardware that can only be connected via a parallel port? It might take you some time to find a computer that still has one of those, or you could try out this USB to Parallel port converter. It’s not limited to working with printers, as the driver builds a virtual parallel port that you should be able to use for any purpose. But what we’re really interested in here isn’t the converter itself, but the build process. [Henrik Haftmann] posted a three-part series of videos on the assembly process, which you can watch after the break.
The build is mostly surface mount soldering with just a handful of components that need to be hand soldered. The first of his videos shows him stenciling solder paste onto the boards. From what we can see it looks like he built a nice jig for this using scrap pieces of copper-clad which match the thickness of the PCB, and hold it and the stencil securely in place. There’s a bunch of other tips you can glean from the videos, like the image seen above. It’s a clamp that holds the PCB and USB jack together while they are soldered.
If you’re ever thinking of assembling a bunch of boards you should set aside thirty minutes to watch them all.
Continue reading “One-man SMD assembly line shares a lot of tips about doing it right”
[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the test boards are being assembled in his basement. Of the first lot of four boards, only one is functional. So he’s setting out to rework the bad boards and we came along for the ride.
To reflow the surface mount components he picked up a cheap pancake griddle. The first thing [Jack] does is to heat up the board for about two minutes, then pluck off the FPGA and the FTDI chips using a vacuum tweezers. Next, the board gets a good cleaning with the help of a flux pen, some solder wick, and a regular soldering iron. Once clean, he hits the pads with solder paste from a syringe and begins the soldering process. BGA packages and the solder paste itself usually have manufacturer recommended time and temperature guidelines. [Jack] is following these profiles using the griddle’s temperature controller knob and the timer on an Android phone. In the video after the break you can see that he adjusts the timing based on gut reaction to what is going on with the solder. After cleaning up some solder bridges on the FTDI chip he tested it again and it works!
Continue reading “Reworking Ball Grid Array circuit board components at home”