Fresh hacks every day
In an effort to ease the process of soldering Ball Grid Array (BGA) chips at home [Roger] rigged up a hands-free solution for his hot air equipment.
The main component in the build is an Aoyue hot air rework station that he already had in his workshop. He wanted an adjustable mount that would hold it steady when reflowing parts … Read the rest
[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the test boards are being assembled in his basement. Of the first lot of four boards, only one is functional. So he’s setting out to rework the … Read the rest
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