For the last five years or so, Nintendo has been selling the 3DS, the latest in a long line of handheld consoles. Around two years ago, Nintendo announced the New Nintendo 3DS, with a faster processor and a few other refinements. The new 3DS comes in two sizes: normal and XL. You can buy the XL version anywhere in the world, but Nintendo fans in North America cannot buy the normal version.
In manufacturing the XL and non-XL versions of the 3DS, Nintendo didn’t change much on the PCBs. Sure, the enclosure is different, but electronically there are really only two changes: the eMMC storage and the Nintendo processor. 3DS are region-locked, so simply swapping out the boards from a normal 3DS to an XL 3DS wouldn’t work; [Stephen] would also like to play US games on his modded console. That leaves only one option: desoldering two chips from a US XL and placing them on the board from a Japanese 3DS.
With a board preheater and heat gun, [Stephen] was able to desolder the eMMC chip off both boards. Of course this meant the BGA balls were completely destroyed in the process, which means reballing the package with solder bits only 0.3mm in diameter. With the US eMMC transplanted to the Japanese board, [Stephen] ended up with an error message that suggested the processor was reading the memory. Progress, at least.
[Stephen] then moved on to the processor. This was a nightmare of a 512 pin BGA package, with 512 pins that needed a tiny dot of solder placed on them. Here, sanity gave way and [Stephen] called up a local board and assembly house. They agreed to solder the chip onto the board and do an x-ray inspection. With the professional rework done, [Stephen] assembled his new US non-XL 3DS, and everything worked. It’s the only one in the world, and given the effort required to make these mods, we’re expecting it to remain the only one for a very long time.
Microcontroller Dev Boards have the main hardware choices already made for you so you can jump right into the prototyping by adding peripherals and writing code. Some of the time they have everything you need, other times you can find your own workarounds, but did you ever try just swapping out components to suit? [Andy Brown] documented his process of transplanting the clock crystal on an STM32F4 Discovery board.
Even if you don’t need to do this for yourself, the rework process he documented in the clip after the break is fun to watch. He starts by cleaning the through-hole joints of the crystal oscillator with isopropyl alcohol and then applies some flux paste to each. From there the rest is all hot air. The crystal nearly falls out due to gravity but at the end he needs to pluck it out with his fingers. We’re happy to see others using this “method” as we always feel like it’s a kludge when we do it. Next he grabs the load caps with a pair of tweezers after the briefest of time under the heat.
We’d like to have a little bit of insight on the parts he replaces and we’re hoping there are a few crystal oscillator experts who can leave a comment below. [Andy] calculates a pair of 30pf load caps for this crystal. We understand the math but he mentions a common value for board and uC input capacitance:
assuming the commonly quoted CP + CI = 6pF
So we asked and [Andy] was kind enough to share his background on the topic:
It’s a general “rule of thumb” for FR4 that the stray capacitance due to the traces on the board and the input (lead) capacitance of the the MCU is in in the range of 4-8pF. I’m used to quoting the two separately (CP,CI) but if you look around you’ll see that most people will combine the two and call it just “CP” and quote a value somewhere between 4 and 8pF. It’s all very “finger in the air” and for general purpose MCU clocks you can get away picking the mid-value and be done with it.
That leaves just one other question; the original discovery board had an in-line resistor on one of the crystal traces which he replaces with a zero ohm jumper. Is it common to include a resistor and what is the purpose for it?
There are only a few more days until The Hackaday Prize semifinalists need to get everything ready for the great culling of really awesome projectsby our fabulous team of judges. Here are a few projects that were updated recently, but for all the updates you can check out all the entries hustling to get everything done in time.
Replacing really, really small parts
The NoteOn smartpen is a computer that fits inside a pen. Obviously, there are size limitations [Nick Ames] is dealing with, and when a component goes bad, that means board rework in some very cramped spaces. The latest problem was a defective accelerometer.
In a normal project, a little hot air and a pair of tweezers would be enough to remove the defective part and replace it. This is not the case with this smart pen. It’s a crowded layout, and 0402 resistors can easily disappear in a large solder glob.
[Nick] wrapped the closest parts to the defective accelerometer in Kapton tape. That seemed to be enough to shield it from his Aoyue 850 hot air gun. The new part was pre-tinned and placed back on the board with low air flow.
How to build a spectrometer
The RamanPi Spectrometer is seeing a lot of development. The 3D printed optics mount (think about that for a second) took somewhere between 12 and 18 hours to print. Once that was done and the parts were cleaned up, the mirrors, diffraction grating, and linear CCD were mounted in the enclosure. Judging from the output of the linear CCD, [fl@C@] is getting some good data with just this simple setup.
My introduction to electronic manufacturing was as a production technician at Pennsylvania Scale Company in Leola PA in the early 1980’s. I learned that to work on what I wanted to work on I had to get my assigned duties done by noon or thereabouts. The most important lesson I had learned as a TV repairman, other than not to chew on the high voltage cable, was to use your eyes first. I would take a box of bad PCB’s that were essentially 6502 based computers that could count and weigh, and first go through inspecting them; usually the contents were reduced 50% right off by doing this. Then it was a race to identify and fix the remaining units and to keep my pace up I had to do my own desoldering.
It worked like this; you could set units aside with instructions and the production people would at some point go through changing components etc. for you or you could desolder yourself. I was pretty good at hand de-soldering 28 and 40 pin chips using a venerable Soldapulit manual solder sucker (as they were known). But to really cook I would wait for a moment when the production de-soldering machine was available. There was one simple rule for using the desoldering station: clean it when done! Failure to do so would result in your access to the station being suspended and then you might also incur the “wrath of production” which was not limited to your lunch bag being found frozen solid or your chair soaked in defluxing chemicals.
In an effort to ease the process of soldering Ball Grid Array (BGA) chips at home [Roger] rigged up a hands-free solution for his hot air equipment.
The main component in the build is an Aoyue hot air rework station that he already had in his workshop. He wanted an adjustable mount that would hold it steady when reflowing parts so he hit Amazon and bought a $14 articulated lamp. After ditching the funnel-shaped shade he bolted a cable clamp to the socket housing. This can be tightened on the hot air wand, with the spring tension of the lamp making it easy and quick to reposition the nozzle. [Roger] sent this project directly to our tips line and we’ve embedded the rest of the project images after the break.
If you’re looking for a more DIY rework solution you should checkout this hot air pencil hack. It uses a desoldering iron, a fish pump, and some metal mesh as a heat sink to put out a stream of very hot air.
[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the test boards are being assembled in his basement. Of the first lot of four boards, only one is functional. So he’s setting out to rework the bad boards and we came along for the ride.
To reflow the surface mount components he picked up a cheap pancake griddle. The first thing [Jack] does is to heat up the board for about two minutes, then pluck off the FPGA and the FTDI chips using a vacuum tweezers. Next, the board gets a good cleaning with the help of a flux pen, some solder wick, and a regular soldering iron. Once clean, he hits the pads with solder paste from a syringe and begins the soldering process. BGA packages and the solder paste itself usually have manufacturer recommended time and temperature guidelines. [Jack] is following these profiles using the griddle’s temperature controller knob and the timer on an Android phone. In the video after the break you can see that he adjusts the timing based on gut reaction to what is going on with the solder. After cleaning up some solder bridges on the FTDI chip he tested it again and it works!