If you’re free the first week of April and don’t mind sitting on a plane for a looooong time you should check out the Hacker Camp that Dangerous Prototypes is planning. We’re sure you remember [Ian Lesnet] who is a Hackaday Alum, creator of the Bus Pirate, and geeky world traveler. Now’s your chance to try out what to him is a way of life.
The event is April 3-5 in Shenzhen, China. Although marketed as a “Hacker Camp”, to us it sounds more like training for those interested in running hardware companies that use the Shenzhen manufacturing district as the anchor of their supply chain. Part of the prep-work for the trip includes submitting board files which will be fabbed and ready for you on the first day. [Ian] and his crew will be your guides for the culture of the area; complete with meals and bar time. But there are also soldering workshops as part of the package. Don’t pooh-pooh the idea. This is unhuman soldering… BGA and QFN soldering instruction from the people who repair cellphones and other microelectronics.
This [Rick Steves] style adventure is the first that we remember hearing about that targets the open hardware community. But we must admit, it sounds like a lot more fun than a European river cruise!
If you think your last project required a lot of soldering, take a look at [Multivac’s] remote controlled and fully-articulable desktop crane lamp. Sure, it’s a 430 microcontroller combined with an LED driver, 32 LEDs, PWM control, and some moving parts: but take a closer look at the structure. The Cramp uses an old HDD as its base, with the crane spinning around the main bearing that previously supported the platter. A system of spools and pulleys provides a reasonable range of motion to the rest of the build. Relocating the entire assembly, however, is evidently an unpleasant task.
[Multivac] based his design on a Liebherr LR1750 Crawler Crane, which he meticulously pieced together using leftover copper salvaged from an upgrade to his home’s mains wiring. A mountain of solder secures what must include several hundred joints—possibly more. The head of the lamp is an elegant exoskeleton-interpretation of industrial designer Eero Saarinen’s TWA Flight Center. You can see the Cramp in action in the video below.
Continue reading “The Cramp: A MSP430-powered crane lamp”
Regular reader and master hacker [Bill Porter] got married. Congratulations [Bill] and [Mara]! The two of them just couldn’t leave their soldering irons at home. The actually swore their vows by soldering together a circuit during the ceremony (blinky wedding dress, el wire tuxedo, and all).
[Kevin] sent in a link to [Red Fathom’s] hacked Wacom tablet. It’s the screen from a Wacom-enabled laptop brought back to life with a Teensy and an LVDS interface module.
The Neato XV-11 is able to find its charging station when the batteries run low. [Derek] figured out that you can make a second station using some reflective tape.
If you use your drill a lot you’ll eventually break the rubber thing that holds the key to the chuck. Here’s a way to 3D print a replacement.
[Torxe] put eight floppy drives to use as a polyphonic Arduino-controlled MIDI player. And while we’re on the subject of Arduino controlled projects you should take a look at this web-interface to tell you if the foosball table is being used.
And finally [Th3 Bad Wolf] sent in this link to a milling machine built out of LEGO. It is able to mill floral foam and uses a lathe-like setup for one of the table axes.
Video distribution amplifiers are used to amplify a video signal and split it into multiple outputs so multiple displays can be driven. They are also used to correct the gain of an incoming video signal. [Andrew] was having trouble with the video signal from an interferometer, and found the issue was caused by a low output gain. His solution was to build his own video distribution amplifier.
The THS7374 appeared to be the perfect chip for this application. It’s a four channel video amplifier IC, and only requires a few passive components to run. The only problem was the package: a 14 pin TSSOP with 0.65 mm pitch. Not fun to solder by hand, especially if you don’t have a PCB.
[Andrew]’s solution was to build his own breakout out of copper-clad board. He worked under a microscope and cut out a pattern for the part, then soldered 30 AWG wire to the pins to make connections. After cleaning off any copper that could cause a short, the board was working, and the video waveform looked great on an oscilloscope.
After testing, even more gain was needed. [Andrew] ended up cascading two of the amplifiers. This method of prototyping doesn’t look easy, but could be worth it when you need a single board.
Having just received a shiny set of PCBs from the fab-house [Devbisme] needed a way to solder the main chip in place. It has a Ball-Grid Array footprint which is notoriously difficult to populate in a home lab. But he makes it look pretty easy and decided to share a video tutorial of the process.
The main tool he used is the paint stripper (heat gun) seen above. Since he didn’t have his own fancy reflow oven he made things work with the gun as his heat source. First he applies a generous layer of liquid solder flux to the BGA footprint on the board. Next he melts some solder onto the tip of his iron and uses it to tin all of the board’s BGA pads. Then it’s time for the critical step of positioning the chip. He uses vacuum tweezers to set it in place, and traditional tweezers to fine-tune its position. From here he heats with the paint stripper for two minutes, starting far above the board and slowly moving closer, with the reverse at the end of the soldering process. Once cool the board is cleaned with distilled water and blown dry with compressed air. After a visual inspection he finishes the application with a 30 minute stay in a 300 degree oven. We’ve included the video after the break for your convenience.
We’ve seen a similar technique used for replacing a chip on an already populated board.
Continue reading “BGA soldering with a paint stripper and stopwatch”
Personally we find this Ball-Grid Array chip-swap rather horrifying. But if you want to beef up the processor on your 701 Eee PC this is what you’ll need to go through. Not only did [Red Fathom] upgrade to a 1.6 GHz chip, but he managed to get the computer to boot up with the new hardware in place.
BGAs are notoriously hard to solder. This hack pulls it off using just a hot air gun. [Red Fathom] heats the board from the underside until the solder melts and he can pluck off the old chip. He then uses a solder braid and iron to remove extra solder from the footprint. After a little cleanup with a cotton swab and some flux he plops in an Intel Pentium M LV 778. It doesn’t look like he added any solder after the cleaning process. Perhaps he’s relying on the small amount left on the tinned pads of the board?
After the break you can see the soldering process and a video of the new processor booting Xandros.
Continue reading “Swapping out Eee PC BGA chip for 1.6 GHz upgrade”
[Andrew Zonenberg] has crossed a line in his electronic hobby projects. The Ball Grid Array (BGA) is a type of chip footprint which most hobbyists leave to the professionals. But he’s learned the skills necessary to use them in his projects. Recently he ran a test batch to show off his soldering process and illustrate one of the errors a novice might make.
For those that are unfamiliar, the BGA footprint is notoriously difficult to accurately solder because it consists of a large grid of tiny points covering the bottom of the chip. There’s no way to get in there with an iron, so soldering depends on accurate placement of solder paste and chip, as well as a near-perfect reflow cycle. Often times it’s difficult for the professionals too. Many blame the heat-failure of Xbox 360 on the complications of the BGA connects for one of the console’s chips.
For this experiment [Andrew] wanted to show what happens if you include vias in the BGA footprint. It’s fine to do so, as long as they’re capped. But if a standard via is included, capillary action ends up pulling the solder down into the via instead of making a connection with the chip. The image above is a cross-section of one such uncapped via, seen on the far right.