Hand soldering BGA parts should be a circus act

Okay, we think it’s¬†questionable¬†when people say they have no problem soldering QFN packages, but BGA? Granted this chip has far fewer balls on it than many, but it’s still quite impressive that [Xevel] was able to solder this BGA breakout by hand.

The chip you see above is a TMP006 infrared temperature sensor from TI. [Xevel] picked up the part but didn’t want to break the bank when prototyping by buying a proper PCB to host it. There are only eight conductors on it, arranged in a grid with 0.5mm pitch. That didn’t seem to scare him off, as the video after the break shows him connecting each to a conductor on a hunk of stripboard.

[Xevel] mentions that this is a dead-bug style project. Usually you glue the part upside down when using that technique, but it needs line of sight to get an accurate temperature reading so he first cut a hole in the substrate. We’d bet he’s using wire-wrapping wire to make the connections. It’s a very fine solid core wire which is perfect for this kind of work.

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