Decapping Integrated Circuits With Sap

[James] is interested in reverse engineering some integrated circuits. One of the biggest hurdles in this process has always been just getting to the guts of the chip. He used acetone to dissolve the plastic case but had trouble getting through the epoxy blob. Commonly, the epoxy is soaked in nitric acid for a few minutes but [James] didn’t have access to that chemical. Instead he popped into the local music store and picked up some rosin (used to make violin bows sticky enough to grab the strings of the instrument). After boiling down the rock-hard rosin and the chip for 20 minutes, he got a clean and relatively undamaged semiconductor that he can easily peer into.