When you buy a chip, how can you be sure you’re getting what you paid for? After all, it’s just a black fleck of plastic with some leads sticking out of it, and a few laser-etched markings on it that attest to what lies within. All of that’s straightforward to fake, of course, and it’s pretty easy to tell if you’ve got a defective chip once you try it out in a circuit.
But what about off-brand chips? Those chips might be functionally similar, but still off-spec in some critical way. That was the case for [Kevin Darrah] which led to his forensic analysis of potentially counterfeit MCU chips. [Kevin] noticed that one of his ATMega328 projects was consuming way too much power in deep sleep mode — about two orders of magnitude too much. The first video below shows his initial investigation and characterization of the problem, including removal of the questionable chip from the dev board it was on and putting it onto a breakout board that should draw less than a microamp in deep sleep. Showing that it drew 100 μA instead sealed the deal — something was up with the chip.
[Kevin] then sent the potentially bogus chip off to a lab for a full forensic analysis, because of course there are companies that do this for a living. The second video below shows the external inspection, which revealed nothing conclusive, followed by an X-ray analysis. That revealed enough weirdness to warrant destructive testing, which showed the sorry truth — the die in the suspect unit was vastly different from the Atmel chip’s die.
It’s hard to say that this chip is a counterfeit; after all, Atmel may have some sort of contract with another foundry to produce MCUs. But it’s clearly an issue to keep in mind when buying bargain-basement chips, especially ones that test functionally almost-sorta in-spec. Caveat emptor.
Counterfeit parts are depressingly common, and are a subject we’ve touched on many times before. If you’d like to know more, start with a guide.
The Stanford University team developed a device that uses lasers to accelerate electrons along etched channels on a silicon chip. The idea for a miniature accelerator has existed since the laser’s invention in 1960, but the requirement for a device to generate electrons made the early proof-of-concepts difficult to manufacture in bulk.
The electromagnetic waves produced by lasers have much shorter wavelengths than the microwaves used in full-scale accelerators, allowing them to accelerate electrons in a far more confined space – channels can be shrunk to three one-thousandths of a millimeter wide. In order to couple the lasers and electrons properly, the light waves must push the particles in the correct direction with as much energy as possible. This also requires the device to generate electrons and transmit them via the proper channel. With an accelerator engraved in silicon, multiple components can fit on the same chip.
Within the latest prototype, a laser hits a grating from above the chip, directing the energy into a waveguide. The electromagnetic waves radiate out, moving with the waveguide until they reach an etched pattern that creates a focused electromagnetic field. As electrons move through the field, they accelerate and gain energy.
The results showed that the prototype could boost the electrons by 915 electron volts, equivalent to the electrons gaining 30 million electron volts over a meter. While the change is not on the scale of SLAC, it does scale up more easily since researchers can fit multiple accelerating paths onto future designs without the bulk of a full-scale accelerator. The chip exists as a single stage of the accelerator, allowing more researchers to conduct experiments without the need to reserve space in expensive full-scale particle accelerators.
We get it, press releases are full of hyperbole. Cerebras recently announced they’ve built the largest chip ever. The chip has 400,000 cores and contains 1.2 trillion transistors on a die over 46,000 square mm in area. That’s roughly the same as a square about 8.5 inches on each side. But honestly, the WSE — Wafer Scale Engine — is just most of a wafer not cut up. Typically a wafer will have lots of copies of a device on it and it gets split into pieces.
According to the company, the WSE is 56 times larger than the largest GPU on the market. The chip boasts 18 gigabytes of storage spread around the massive die. The problem isn’t making such a beast — although a normal wafer is allowed to have a certain number of bad spots. The real problems come through things such as interconnections and thermal management.
There can be few of us who haven’t gazed with fascination upon the work of IC decappers, whether they are showing us classic devices from the early years of mass semiconductor manufacture, or reverse-engineering the latest and greatest. But so often their work appears to require some hardcore scientific equipment or particularly dangerous chemicals. We’ve never thought we might be able to join the fun. [Generic Human] is out to change all that, by decapping chips using commonly available chemicals and easy to apply techniques. In particular, we discover through their work that rosin — the same rosin whose smell you will be familiar with from soldering flux — can be used to dissolve IC packaging.
Of course, ICs that dissolved easily in the face of soldering wouldn’t meet commercial success, so an experiment with flux meets little success. Pure rosin, however, appears to be an effective decapping agent. [Generic Human] shows us a motherboard voltage regulator boiled in the stuff. When the rosin is removed with acetone, there among the debris is the silicon die, reminding us just how tiny these things are. We’re sure you’ll all be anxious to try it for yourselves, now, so take a while to look at the video below showing their CCC Congress talk.
The master of chip decapping is of course [Ken Shirriff], whose work we’ve featured many times. Our editor [Mike Szczys] interviewed him last year, and it’s well worth a look.
Not every computer is a performance gaming rig. Some of us need cheap laptops and tablets for simple Internet browsing or word processing, and we don’t need to shell out thousands of dollars just for that. With a cheaper price tag comes cheaper hardware, though, such as the eMMC standard which allows flash memory to be used in a more cost-advantageous way than SSDs. For a look at some the finer points of eMMC chips, we’ll turn to [Jason]’s latest project.
[Jason] had a few damaged eMMC storage chips and wanted to try to repair them. The most common failure mode for his chips is “cratering” which is a type of damage to the solder that holds them to their PCBs. With so many pins in such a small area, and with small pins themselves, often traditional soldering methods won’t work. The method that [Jason] found which works the best is using 0.15 mm thick glass strips to aid in the reflow process and get the solder to stick back to the chip again.
Doing work like this can get frustrating due to the small sizes involved and the amount of heat needed to get the solder to behave properly. For example, upgrading the memory chip in an iPhone took an expert solderer numerous tries with practice hardware to finally get enough courage to attempt this soldering on his own phone. With enough practice, the right tools, and a steady hand, though, these types of projects are definitely within reach.
Building an LED matrix is a fun project, but it can be a bit of a pain. Usually it starts with hand-soldering individual LEDs and resistors together, then hooking them up to rows and columns so they can be driven by a microcontroller of some sort. That’s a lot of tedious work, but you can order an LED matrix pre-built to save some time and headache. You’ll still need a driver though, and while building one yourself can be rewarding there are many pitfalls and trade-offs to consider when undertaking that project as well. Or, you can consider one of a number of drivers that [deshipu] has outlined in detail.
The hangups surrounding the driver board generally revolve around the issue of getting constant brightness from LEDs regardless of how many in the row or column are illuminated at one time. Since they are typically driven one row or column at a time, the more that are on the lower the brightness each LED will have. Driver boards take different approaches to solving this problem, which usually involve a combination of high-speed scanning of the matrix or using a constant-current source in order to eliminate the need for resistors. [deshipu] outlines four popular chips that achieve these purposes, and he highlights their pros and cons to help anyone looking to build something like this.
Most of these boards will get you to an 8×8 LED matrix with no problem, with a few going a few pixels higher in either direction. That might be enough for most of our needs, but for something larger you’ll need other solutions like the one found in this 64×32 LED matrix clock. There are also even more complicated drivers if you go into extra dimensions.
“Gummy” might not be an adjective that springs to mind when describing metals, but anyone who has had the flutes of a drill bit or end mill jammed with aluminum will tell you that certain metals do indeed behave in unhelpful ways. But a new research paper seeks to shed light on the gummy metal phenomenon, and may just have machinists stocking up on office supplies.
It’s a bit counterintuitive that harder metals like steel are often easier to cut than softer metals; especially aluminum but also copper, nickel alloys, and some stainless steel alloys. But it happens, and [Srinivasan Chandrasekar] and his colleagues at Purdue University wanted to find out why, and what can be done about it. So the first job was to get up close and personal with the interface between a cutting tool and metal stock, to observe the dynamics of cutting. In a fascinating bit of video, they saw that softer metals tend to fold in sinuous patterns rather than breaking on defined shear planes.
Having previously noted that cutting through Dykem, a common machinist’s marking fluid, changes chip formation in soft metals, the researchers tested everything from Sharpies to adhesive tape and even correction fluid, and found that they all helped to reduce the gumming action to some degree. Under their microscope they can clearly see that chips form differently once the cutting edge hits the treated surface, tending to act more brittle and ejecting rather than folding. They also noted a marked decrease in cutting force for the treated metal, and much-improved surface finish to boot.
Will Sharpies and glue sticks enter the book of old machinist’s tricks like gauge-block wringing? Only time will tell. But for now, this is a pretty fascinating bit of research that you might be able to put to the test in your shop. Let us know what you find in the comments.