For the last few months, I’ve been up to my neck in electronic conference badges. This year, I created the single most desirable badge at DEF CON. I also built a few Tindie badges, and right now I’m working on the logistics behind the Hackaday SuperConference badge. Sit tight on that last one — we’re doing something really, really special next month.
Most badge projects are one-off production runs. This is to be expected from a piece of hardware that’s only meant to be distributed at a single event. The Tindie badge is different. It’s now a thing, and we’re building multiple badges for all the cons and conferences Hackaday and Tindie are attending for the rest of the year. This means I have the opportunity to do hardware revisions on the Tindie badge. Right now I’ve built three versions of the Tindie and we’ve distributed about two thousand of these kits at DEF CON, Maker Faire New York, and the Open Hardware Summit.
After about two thousand units, I think we finally have this down. This is how I designed three versions of hardware in as many months and cut the BOM cost of each badge in half. This is bordering on a marginally impressive piece of engineering, and a great lesson on BOM cost optimization.
Continue reading “BOM Cost Optimization And Tindie Badge Engineering”
