sonication

2 Articles

How Safe Is That Ultrasonic Bath For Flux Removal?

December 5, 2019 by 30 Comments

How do you clean the residual flux off your boards? There are plenty of ways to go about the job, ranging from “why bother?” to the careful application of isopropyl alcohol to every joint with a cotton swab. It seems like more and more people are turning to ultrasonic cleaners to get the job done, though, and for good reason: just dunk your board and walk away while cavitation does the work for you.

But just how safe is it to sonically blast the flux off your boards? [SDG Electronics] wanted to know, so he ran some cleaning tests to get to the bottom of things. On the face of it, dunking a PCB in an aqueous cleaning solution seems ill-advised; after all, water and electricity famously don’t mix. But assuming all the nooks and crannies of a board can be dried out before power is applied, the cleaning solution itself should be of little concern. The main beef with ultrasonic cleaning seems to be with the acoustic energy coupling with mechanical systems on boards, such as crystal oscillators or micro-electrical-mechanical systems (MEMS) components, such as accelerometers or microphones. Such components could resonate with the ultrasonic waves and be blasted to bits internally.

To test this, [SDG Electronics] built a board with various potentially vulnerable components, including the popular 32.768-kHz crystal, cut for a frequency quite close to the cleaner’s fundamental. The video below goes into some detail on the before-and-after tests, but the short story is that nothing untoward happened to any of the test circuits. Granted, no components with openings as you might find on some MEMS microphones were tested, so be careful. After all, we know that ultrasound can deal damage, and if it can levitate tiny styrofoam balls, it might just do your circuit in.

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Vintage Fairchild IC Proves Tough To Decap

May 27, 2019 by 12 Comments

You’d think that something called “white fuming nitric acid” would be more than corrosive enough to dissolve just about anything. Heck, it’s rocket fuel – OK, rocket fuel oxidizer – and even so it still it wasn’t enough to pop the top on this vintage Fairchild μL914 integrated circuit, at least not without special measures.

As [John McMaster], part of the team that analyzed the classic dual 2-input NOR gate RTL chip from the 1960s, explains it, decapping modern chips is a straightforward if noxious process. Generally a divot is milled into the epoxy, providing both a reservoir for the WFNA and a roughened surface for it to attack. But the Fairchild chip, chosen for dissection for the Maker Faire Bay Area last week specifically because the features on the die are enormous by modern standards, was housed in an eight-lead TO-99 case with epoxy that proved nigh invulnerable to WFNA. [John] tried every chemical and mechanical trick in the book, going so far as to ablate epoxy with a Nd:YAG laser. He eventually got the die exposed, only to discover that it was covered with silicone rather than the silicon dioxide passivation layer of modern chips. Silicone can be tough stuff to remove, and [John] resorted to using lighter fluid as a solvent and a brush with a single bristle to clean up the die.

We applaud the effort that this took, which only proves that decapping is more art than science sometimes. And the results were fabulous; as Hackaday editor-in-chief [Mike Szczys] notes, the decapping led to his first real “a-ha moment” about how chips really work.

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