When doing surface-mount assembly you can certainly use a soldering iron in the traditional way, but it’s far more convenient to cover the pads with solder paste, place the components, and bake the board in a reflow oven. If you’re lucky enough to have a precut stencil this can be done in one go, otherwise a tiny blob of paste must be laboriously placed on each pad by hand. [Kevarek] has made this a bit easier by designing a low-cost handheld solder paste dispenser.
The unit takes the form of a handheld 3D printed wand containing a geared motor and a threaded shaft, that engages with a syringe full of paste clamped onto its end. There’s a control box powered by an STM32 microcontroller that not only allows adjustment of flow rate, but provides advanced features such as performing a slight retraction at the end of dispensing to avoid excess paste. There’s a push-button on the wand for control, as well as a set on the control box to adjust its parameters.
If you’ve ever handled solder paste, you’ll know it can be a uniquely annoying and finicky substance. Either it’s too stiff and clumps together, or too runny and spreads out. No doubt some readers are lucky enough to always have fresh paste of the highest quality to hand, but too often a hackerspace will have a tub of grey goop with uncertain provenance. We like this tool, and while it won’t make up for poor quality or badly stored paste, at least it’ll make applying paste a breeze.
We’ve covered paste dispensers quite a few times in the past, but you might also wish to read our in-depth guide to the subject.
