PID SMD reflow hot plate
posted Jan 16th 2009 7:30pm by Eliotfiled under: misc hacks, tool hacks

[mightyohm] put together a nice piece of lab kit. It’s a PID controlled hot plate. The plate is capable of reaching 500F, hot enough to do SMD reflow soldering. The large chunk of metal has a hole drilled through the center to contain a cartridge heater. A thermocouple is used to monitor the temperature of the plate. Ceramic standoffs separate the plate from the rest of the device, but he still needs to come up with a way to stop the radiant heating. The control box houses the surplus PID controller along with the power switch and solid state relay (SSR).








My guess is that the base plate does not only heat up by radiant heating, but also by conduction thru air. To lower the radiant heating, one might polish that base plate (I guess), but maybe there are better materials to isolate the hot plate. I’d love to make a suggestion, but I don’t know any properties from any materials.
I’m guessing that the time to heat up that block (even with a 500W heater and a PID controller) does take a minute and might be quicker by using a thinner block. So is there a specific reason why the hot plate is so massive?
Seems like a very handy tool, I might make my own one day.