Super Thin ICs Are Coming

An ordinary integrated circuit is made of layers of material. Typically a layer is made from some material (like silicon dioxide, polysilicon, copper, or aluminum). Sometimes a process will modify parts of a layer (for example, using ion implantation to dope regions of silicon). Other times, some part of the layer will be cut away using a photolithography process.

Researchers at MIT have a new technique that allows super thin layers (1-3 atoms thick) and–even more importantly–enables you to use two materials in the same layer. They report that they have built all the basic components required to create a computer using the technique.

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