One of the things that stops electronic devices from going faster is heat. That’s why enthusiasts go as far as using liquid nitrogen to cool CPU chips to maximize their overclocking potential. Researchers at Georgia Tech have been working on cutting fluid channels directly into the back of commercial silicon die (an Altera FPGA, to be exact). The tiny channels measure about 100 micron and are resealed with another layer of silicon. Water is pumped into the channels to cool the device efficiently.
A comparable air-cooled device would operate at about 60 degrees Celsius. With the water cooling channels cut into the die and 20 degree water pumped at 147 ml/minute, the researchers kept the chip operating about less than 24 degrees Celsius.
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