Chip decapping videos are a staple of the hacking world, and few things compare to the beauty of a silicon die stripped of its protective epoxy and photographed through a good microscope. But the process of actually opening that black resin treasure chest seems elusive, requiring as it does a witch’s brew of solvents and acids.
Or does it? As [Curious Marc] documents in the video below, a little heat and some finesse are all it takes, at least for some chips. The method is demonstrated by [Antoine Bercovici], a paleobotanist who sidelines as a collector of old chips. After removing chips from a PCB — he harvested these chips from an old PlayStation — he uses hot air to soften the epoxy, and then flexes the chip with a couple of pairs of pliers. It’s a bit brutal, but in most of the Sony chips he tried for the video, the epoxy broke cleanly over the die and formed a cleavage plane that allowed the die to be slipped out cleanly. The process is not unlike revealing fossils in sedimentary rocks, a process that he’s familiar with from his day job.
He does warn that certain manufacturers, like Motorola and National, use resins that tend to stick to the die more. It’s also clear that a hairdryer doesn’t deliver enough heat; when they switched to a hot air rework station, the success rate went way up.
The simplicity of this method should open the decapping hobby up to more people. Whether you just want to take pretty pictures or if reverse engineering is on your mind, put the white fuming nitric acid down and grab the heat gun instead.
Thanks to [killergeek] for the tip.