While it’s arguably a bit closer to the “Arts & Crafts” region of the making spectrum upon which we don’t usually tread on account our l33t sense of superiority, we’ve got to admit that the quick and easy notebook customization demonstrated by [Sean Hodgins] is very compelling. We don’t put ink to dead trees with nearly the frequency we used to, but when we do it might as well be Hemingway-style with a little black Hackaday emblazoned notebook.
As demonstrated in the video after the break, the process starts by designing the stamp in your CAD package of choice. For optimal results [Sean] suggests fairly large capital letters, but with practice you should be able to get into some more creative fonts. Potentially you could even use the logo of your favorite hacking blog, but who are we to dictate what you do?
Whatever you chose, it needs to be mirrored and placed on a relatively thick backing. He recommends a 2 mm thick “plate” with the letters raised on top. You’ll want to print it at a high infill percentage, but even still it shouldn’t take more than 30 minutes or so to run off. Remember there tends to be diminishing returns on infill past 50%, so taking it all the way to 100% is not going to do much but expend more time and plastic.
Once printed, [Sean] hot glues the stamp to a block of wood since putting pressure on the printed piece directly would likely crack it. Then it’s just a matter of getting your notebook, printed stamp, and blocks of wood lined up in to a suitably beefy bench vise. Getting everything aligned is one of those things that easier said than done, so expect to mess up the first couple until you get the hang of it.
When the alignment looks good, crank it down and let it sit for a few minutes. If you’re embossing the design into actual leather, wetting it a bit before putting the pressure on should help. The final effect is understated but undeniably very slick; and with the Holidays rapidly approaching this might be an excellent way to knock out some legitimately thoughtful gifts.
For most of human history, our inventions and innovations have been at a scale that’s literally easy to grasp. From the largest cathedral to the finest pocket watch, everything that went into our constructions has been something we could see with our own eyes and manipulate with our hands. But in the middle of the 20th century, we started making really, really small stuff: semiconductors. For the first time, we were able to create mechanisms too small to be seen with the naked eye, and too fine to handle with our comparatively huge hands. We needed a way to scale these devices up somewhat to make them useful parts. In short, they needed to be packaged.
We know that the first commercially important integrated circuits were packaged in the now-familiar dual in-line package (DIP), the little black plastic millipedes that would crawl across circuit boards for the next 50 years. As useful and versatile as the DIP was, and for as successful as the package became, its design was anything but obvious. Let’s take a look at the dual in-line package and how it got that way.
In the closing months of World War II, the Axis and the Allies were throwing everything they had at each other. The tide was turning to the Allies’ favor, but the Germans were showing a surprising resilience, at least in terms of replacing downed fighter and bomber aircraft. When the Allies examined the wreckage of these planes, they discovered the disturbing truth: the planes contained large pieces forged from single billets of metal, which suggested a manufacturing capability none of the Allies possessed and which allowed the Germans to quickly and cheaply make better and faster planes.
When the war was over, the Allies went looking for the tools the Germans had used to make their planes, and found massive closed-die forging presses that could squeeze parts out of aluminum and magnesium alloys in a single step. The Soviets carted off a 30,000 ton machine, while the Americans went home with a shipload of smaller presses and the knowledge that the Russians had an edge over them. Thus began the Heavy Press Program, an ultimately successful attempt by the US military to close a huge gap in strategic manufacturing capabilities that [Machine Thinking] details in the excellent video below.
One doesn’t instantly equate monstrous machines such as the Mesta 50,000-ton press, over nine stories tall with half of it buried underground and attached directly to bedrock, with airplane manufacture. But without it and similar machines that came from the program, planes from the B-52 to the Boeing 747 would have been impossible to build. And this isn’t dead technology by any means; sold to Alcoa in 1982 after having been operated by them for decades, the “Fifty” recently got a $100 makeover after cracks appeared in some castings, and the press and its retro-brethren are still squeezing out parts for fighters as recent as the F-35.
It’s easy to assume that older components will be less integrated and bulkier than we might otherwise expect. Then something seems ahead of its time, like the teeny-tiny 490IP1 LED which was produced in the former Soviet Union. [AnubisTTP] obtained and shared images of this tiny integrated single digit LED display in which the number measures a scant 2.5 mm tall; in production it was made easier to read with an external bubble lens magnifier clipped to the outside. The red brick the 490IP1 is pictured with is the Texas Instruments TIL306, a relatively normal sized DIP component with similar functionality.
The 490IP1 is called an intelligent LED display because the package contains a decade counter and driver circuitry for the integrated seven-segment LED digit, complete with a carry signal that meant multiple displays could be chained together. It is notable not just due to its size, but because the glass cover makes it easy to see the die inside, as well as the wire-bonded pads.
It’s always fascinating to see glimpses of the development path that display technologies took. It’s easy to take a lot of it for granted today, but back before technology was where it is now, all sorts of things were tried. Examples we’ve seen in the past include the fantastic (and enormous) Eidophor projector which worked by drawing images onto a rotating disk of oil with an electron gun. On the smaller end of things, the Sphericular display used optics and image masks to wring a compact 0-9 numerical display out of only a few lamps at the back of a box.
In an age of smartwatches, an analog watch might seem a little old-fashioned. Whether it’s powered by springs or a battery, though, the machinery that spins those little hands is pretty fascinating. Trouble is, taking one apart usually doesn’t reveal too much about their tiny workings, unless you get up close and personal like with this microscopic tour of an analog watch.
This one might seem like a bit of a departure from [electronupdate]’s usual explorations of the dies within various chips, but fear not, for this watch has an electronic movement. The gross anatomy is simple: a battery, a coil for a tiny stepper motor, and the gears needed to rotate the hands. But the driver chip is where the action is. With some beautiful die shots, [electronupdate] walks us through the various areas of the chip – the oscillator, the 15-stage divider cascade that changes the 32.768 kHz signal to a 1 Hz pulse, and a remarkably tiny H-bridge for running the stepper. We found that last section particularly lovely, and always enjoy seeing the structures traced out. There are even some great tips about using GIMP for image processing. Check out the video after the break.
For those not into the anatomy and physiology of semiconductors, getting a look at the inside of the chip can reveal valuable information needed to reverse engineer a device, or it can just scratch the itch of curiosity. Lapping (the gentle grinding away of material) is one way to see the layers that make up the silicon die that lies beneath the epoxy. Hard drives designed to spin at 7200 rpm or more hardly seem a suitable spinning surface for a gentle lapping, but [electronupdate] just wanted the platter for its ultra-smooth, ultra-flat surface.
He removed the heads and replaced the original motor with a gear motor and controller to spin the platter at less than 5 rpm. A small holder for the decapped die was fashioned, and pinched between the platter hub and an idler. It gently rotates the die against the abrasive-covered platter as it slowly revolves. But the die wasn’t abrading evenly. He tried a number of different fixtures for the die, but never got to the degree of precision needed to see through the die layer by layer. We wonder if the weight of the die fixture is deflecting the platter a bit?
Failure is a great way to learn, if you can actually figure out where you went wrong. We look to the Hackaday community for some insight. Check out the video below and sound off in the comments if you’ve got any ideas.
When you think of machine tooling, what comes to mind might be an endmill made of tungsten carbide or a punch and die made of high-speed steel. But surely there’s no room in the machine tool world for 3D-printed plastic tools, especially for the demanding needs of punching parts from sheet metal.
As it turns out, it is possible to make a 3D-printed punch and die set that will stand up to repeated use in a press brake. [Phil Vickery] decided to push the tooling envelope to test this, and came away pleasantly surprised by the results. In fairness, the die he used ended up being more of a composite between the carbon-fiber nylon filament and some embedded metal to reinforce stress points in the die block. It looks like the punch is just plastic, though, and both were printed on a Markforged Mark 2, a printer specifically designed for high-strength parts. The punch and die set were strong enough to form 14-gauge sheet steel in a press brake, which is pretty impressive. The tool wasn’t used to cut the metal; the blanks were precut with a laser before heading to the press. But still, having any 3D-printed tool stand up to metal opens up possibilities for rapid prototyping and short production runs.