Linux Distributions And Who Is Responsible For The Software

The topic of downstream and upstream is an important one in the Linux ecosystem, where from one base distribution you can go many layers of distros deep before even looking at all the other base distributions. Within that veritable jungle you get questions about who is responsible for packaging software, where to report bugs found with a specific application, as well as what ‘LTS’ truly means in a consumer context. These and other points are raised in a recent video by [Brodie Robertson], with many examples of things going tragically wrong.

There’s a good argument to be made that ultimately it is the distro that is responsible for the software that they provide via their repositories. As [Brodie] shows in the video, there are a few cases where an ‘LTS’ distro uses an old version of some software that contains a bug that has been fixed a while ago, so reporting it to the developer is rather pointless, while the distro maintainers should fix it with backporting of patches or updating the version.

From an end user experience this also makes the most sense, as in the end they just want to have the Windows experience of downloading a proverbial installer, clicking through whatever dialogs pop and have working software. If the software is provided via the distro, it is their responsibility, the same way that you contact the developer if you get a DEB or RPM from a GitHub project page and it doesn’t work.

This current Linux Chaos Vortex can be called a major issue when e.g. FreeBSD has no such upstream/downstream issues, with cross-platform installers being basically impossible on Linux ever since the Linux Standard Base effort died.

Perhaps Linux will get a distroless future, however, which may finally herald that Year of the Linux Desktop.

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Autopsy Of A Failed Vintage Carbon Resistor

Detail of the lead connecting to the inner carbon-filled tube. (Credit: CuriousMarc)
Detail of the lead connecting to the inner carbon-filled tube. (Credit: CuriousMarc)

Although resistors are hardly among the most exciting components, they are arguably one of the most important ones, as anyone who has done any amount of circuit design and debugging can attest to. So too with a single carbon resistor in a vintage Metrix oscilloscope that [CuriousMarc] recently repaired. After recapping the board there was still a major issue that got traced down to said resistor. After replacing it with a fresh resistor obviously this meant doing an autopsy to see why the old resistor had failed.

The 20 kOhm-rated resistor looked fine on the outside, with no obvious damage or discoloration, but it measured around 0.843 MOhm. To get to the insides [CuriousMarc] asked his friend [TubeTime] on how to proceed. The answer here was sandpaper and a lot of patience, and thus the experiment to see how much sanding it takes to get to the core of a fairly big resistor commenced.

Ultimately the insides were revealed, and they turned out to be rather interesting, with what looked like a glass tube filled with what would be the carbon-laden material between the two lead terminals. From poking around a bit at these insides it would appear that the failure mode was a degraded contact between these terminals and the carbon material. Considering that this resistor is many decades old and has gone through many thermal cycles and potentially various kinetic events some fractures are probably to be expected.

Perhaps most fascinating is the construction of this carbon resistor that looks to be a step above that of the average carbon resistor that [TubeTime] has taken apart over the years.

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Inside Dyson’s Over-Engineered ₤1000 Hand Dryer

It seems fair to say that Dyson sits at the intersection of impressive engineering and borderline ridiculous products. The Dyson Airblade 9KJ hand dryer that [ElectrArc240] recently took to bits would definitely seem to fall under the latter, combining an incredible amount of engineering all for the simple task of drying wet hands.

These hand dryers are rated for a cool 900 Watts, with an 0.5 W standby power consumption, though you can also switch it to a 650 W ‘eco mode’ when installing it. The air that gets sucked into the dryer first passes through a HEPA filter before it hits the heating element and then gets blown out of the handles onto one’s hands.

Both of these handles come with a presence sensor in the form of an ST VL53L3CX time-of-flight sensor, along with a path for the heated air towards the thin slits. Returning to the section just past the HEPA filter is the compressor, with a rather fancy airflow path that involves various stacked meshes. As can be seen in the video, where you’d expect basically a simple blower motor or so, there is a truly astounding amount of parts as the teardown progresses.

The motor disassembly is the first part where some desoldering and breaking of glue bonds is really necessary, but it gives full access to the driver board. The circuit used here is your typical IGBT-based driver, though with a mystery PIC MCU to do things. Following this the tear-down turns fully destructive, giving access to the motor internals.

Following an analysis of these internals we marvel at the carbon-fiber rotor that keeps the single magnet in one piece. This is another engineering choice that serves to justify the 1,000 quid price tag. All so that rest room visitors do not have to suffer the humility of using paper towels.

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AMOC And The Planet-Wide Impact Of Ocean Currents

Although it can be hard to tell from looking at the often placid waters of the Earth’s oceans, their currents carry immense amounts of water around the globe on a daily basis, underlying a dynamic system that – much like the Earth’s atmosphere – plays a major role in everything from weather systems to local climates and ecosystems.

Of all these ocean currents the Atlantic meridional overturning circulation (AMOC) is perhaps the most famous, as it is basically the sole reason why Europe has the mild climate that it does today, courtesy of it carrying thermal energy from the equator all the way to the coast off Scandinavia.

Although collapsing an ocean current seems as improbable as stopping the jet streams in the upper atmosphere, it’s actually significantly easier due to how much ocean currents rely on factors that we can fairly easily influence. Over the past decades we have seen worrying signs that the AMOC is indeed weakening, with the million-dollar question being what scenario we’ll be looking at.

While collapsing the AMOC within a decade may be theoretically possible, current models seem to point towards a weakening by about half by the end of this century, with a recent research article by Valentin Portmann et al. in Science Advances going over the various statistical models to come to this conclusion.

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Honeywell X2S Smart Thermostat Firmware Reverse-Engineering

The Honeywell X2S Smart Thermostat is a Wi-Fi-enabled thermostat that is meant to integrate with your typical ‘smart home’ setup, with mobile app control available as well. Of course, just using it as-is would be extremely boring, so fortunately we have [author0] to take it apart and reverse-engineer its encrypted firmware.

Of the two brains in this thermostat the first is a succinctly named Renesas R7FA6M4AF3CFP MCU containing a 200 MHz Cortex-M33 core with TrustZone features to theoretically keep out any firmware hackers. Handling the wireless side is a Realtek RTL8721DM Wi-Fi/BLE 5.0 SoC. There are also two Winbond Flash chips connected to these two main chips, with their contents of course encrypted.

Fortunately there are plenty of test points to connect to, for which a custom pogo-pin equipped breakout board was created. Cracking the encryption for the Realtek turned out to be as simple as using its RSIP decrypt-on-the-fly feature. From there exploring the firmware was the next step, with a TLS issue pertaining to certificates found to make man-in-the-middle attacks easy, along with a seeding bug that makes recovering session keys possible.

Although the Renesas MCU firmware still has to be decrypted and the full wireless handshake reverse-engineered, these do seem to be solid steps towards fully reverse-engineering this thermostat. It also makes it very clear once again that the ‘S’ in IoT absolutely stands for ‘security’. Maybe that’s why the smart home bubble popped.

Figuring Out What James Webb’s Mysterious Little Red Dots Are

After the James Webb Space Telescope (JWST) began operations in 2022, it soon made a tantalizing discovery in the form of mysterious red dots: small, red-tinted astronomical objects of unknown origin and composition. So far well over 300 of such little red dots (LRDs) have been identified, with many theories on what they are. Fortunately the Chandra X-ray Observatory recently added some more clues as detailed in an accompanying paper.

Current theories include them being a form of primordial galaxy, or a supermassive black holes embedded in a dense gas cloud. The LRD discussed in the paper with the designation 3DHST-AEGIS-12014 was found to emit X-rays unlike other LRDs. By comparing the data between JWST and Chandra for this LRD it lends credence to the theory that these LRDs are a transitional phase as a supermassive black hole ingests the material of said gas cloud.

X-rays produced during this can sometimes make it out of the gas cloud, after which we can observe it. If that’s the case, these LRDs should cease to exist the moment the black hole has consumed enough of the cloud, which is something that we may be able to find evidence for if we’re lucky.

This adds just another reason why keeping the Chandra X-ray Observatory mission funded, after it narrowly got saved in 2024.

Through-Glass Vias And The Long Road To Glass Substrates

Credit: Keith Best, Semiengineering.
Credit: Keith Best, Semiengineering.

Glass-based substrates are slowly beginning to push out organic substrates – as also commonly used in PCBs – due to often superior material properties for packaging. One area where glass substrates have however struggled is with through-hole vias and providing the conductive copper path through them. A 2024 article by [Keith Best] gives a good overview of the topic, with recent news showing how much companies like Intel are pushing for glass substrates, specifically for the packaging of dies.

One major advantage with vias in glass substrates is that they can be much smaller, enabling smaller than 0.1 mm diameter holes with far finer pitch. The challenge here is to make perfect holes with a laser that are defect-free, as well as have the intended diameter.

After that this through-glass via (TGV) has to be coated or filled with copper, much like their organic equivalent. Said TGV can be fully filled with copper, or use plating and add dielectric filler. Detecting flaws in such a finished TGV is important.

In a 2025 review article of glass substrate technologies by [Pratik Nimbalkar] et al. published in Chips the state of the art at the time was covered. The need for ever higher-density integration options with ASICs is highlight here, especially now that many chips today consist of multiple interconnected dies inside a single package.

The complications of creating TGVs with femtosecond laser pulses in Borofloat 33 glass are highlighted by [Daniel Franz] et al. in a 2025 research article, with microcracks and backside ablation observed without proper precautions, something which previously was often resolved by an etching step following said laser drilling. The main issue here is the post-drilling residual stress from the thermal shock, which the authors demonstrate can be largely prevented with careful tweaking of the laser drilling parameters.

As pointed out in a 2024 review article by [Chen Yu] et al. glass substrates are useful for far more than just high-density chip packaging. Glass substrates are also chemically resistant, have a higher heat resistance, are largely transparent to RF and can be hermetically sealed against outside influences. This makes them great for various advanced sensors and communication devices.

Meanwhile, if you wanted to do some metal-depositing on glass at home, we covered this recently.