Elliot Williams and Mike Szczys take a look at advances in photogrammetry (building 3D models out of many photographs from a regular camera), a delay pedal that’s both aesthetically and aurally pleasing, and the power of AI to identify garden slugs. Mike interviews Scotty Allen while walking the streets and stores of the Shenzhen Electronics markets. We delve into SD card problems with Raspberry Pi, putting industrial controls on your desk, building a Geiger counter for WiFi, and the sad truth about metal 3D printing.
Take a look at the links below if you want to follow along, and as always, tell us what you think about this episode in the comments!
You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die is flipped upside down so the active surface is closest to the PCB. As opposed to the more traditional method in which the IC is face-up and connected to the packaging with bond wires, this allows for ultimate packaging efficiency and impressive performance gains. We hear a lot about advances in the integrated circuits themselves, but the packages that carry them and the issues they solve — and sometimes create — get less exposure.
Let’s have a look at why semiconductor manufacturers decided to turn things on their head, and see how radioactive solder and ancient Roman shipwrecks fit in.