In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – soldering those chips onto the board is quite another. If you’ve got some experience with SMD soldering, you’ll find that any SOIC, TQFP or even QFN package can be soldered with a fine-tipped iron and a bit of practice. Not so for BGAs: we’ll need to bring out some specialized tools to solder them correctly. Today, we’ll explore how to get those chips on our board, and how to take them off again, without spending a fortune on equipment.
Tools of the Trade
For large-scale production, whether for BGA-based designs or any other kind of SMD work, reflow ovens are the tool of choice. While you can buy reflow ovens small enough to place in your workshop (or even build them yourself), they will always take up quite a bit of space. Reflow ovens are great for small-scale series production, but not so much for repairs or rework. Continue reading “Working With BGAs: Soldering, Reballing, And Rework”