Once a printed circuit board (PCB) has been assembled it’s rather hard to look inside of it, which can be problematic when you have e.g. a multilayer PCB of an (old) system that you really would like to dissect to take a look at the copper layers and other details that may be hidden inside, such as Easter eggs on inner layers. [Lorentio Brodeso]’s ‘LACED’ project offers one such method, using both chemical etching and a 5 Watt diode engraving laser to remove the soldermask, copper and FR4 fiberglass layers.
This project uses sodium hydroxide (NaOH) to dissolve the solder mask, followed by hydrogen chloride (HCl) and hydrogen peroxide (H2O2) to dissolve the copper in each layer. The engraving laser is used for the removing of the FR4 material. Despite the ‘LACED’ acronym standing for Laser-Controlled Etching and Delayering, the chemical method(s) and laser steps are performed independently from each other.
This makes it in a way a variation on the more traditional CNC-based method, as demonstrated by [mikeselectricstuff] (as shown in the top image) back in 2016, alongside the detailed setup video of how a multi-layer PCB was peeled back with enough resolution to make out each successive copper and fiberglass layer.
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