In today’s episode of Diminutive Device Technology Overview, [Sprite_TM] is at it again – this time conquering the HC32L110. A few weeks ago, we have highlighted the small ARM Cortex M0+ microcontroller, which is outstanding because of its exceptionally small size. We also pointed out a few hurdles, among them – hard-to-approach SDK and documentation, and difficulties making and assembling a PCB for such a small BGA. Today, we witness how [Sprite_TM] bulldozed through all of these hurdles for all of us, and added a few pictures to our collective “outrageous soldering” galleries while at it.
First, he figured out an example layout for this MCU that’s achievable for us even on a cheapest 2-layer board from JLCPCB, keeping distances within the generic tolerance standards by snubbing out a few pins. As a result, we only lose access to four GPIOs – those will have to be kept as inputs, so that nothing burns out. However, that’s the kind of tradeoff we are okay making if it helps us keep our PCB small and lightweight for projects where these factors matter. After receiving the resulting board, he also recorded a short tutorial on soldering such packages at home with a mere hot air gun and a few bare necessities like flux and tweezers – embedded below.
It doesn’t end there, however, as he decided to work around the GPIO fanout limitation in a non-intended way. Evidently, [Sprite_TM] decided to have some fun, taking a piece of regular 0.1″ spacing protoboard and deadbugging the chip with magnet wire, much to our amusement. The resulting contraption, pictured above, worked – and this is ever something you’d like to be able to achieve yourself in times of dire need, whether you make something work or simply to be entertained by making use of a cursed mounting technique, there’s an one-hour-long livestream recording of how this magnet wire contraption came to be. And, of course, that wasn’t the last thing to be shared.
Continue reading “Heroic Efforts Give Smallest ARM MCU A Breakout, Open Debugger”
We’ve been contacted by [Cedric], telling us about the smallest ARM MCU he’s ever seen – Huada HC32L110. For those of us into miniature products, this Cortex-M0+ package packs a punch (PDF datasheet), with low-power, high capabilities and rich peripherals packed into an 1.6mm x 1.4mm piece of solderable silicon.
This is matchstick head scale computing, with way more power than we previously could access at such a scale, waiting to be wrangled. Compared to an 8-bit ATTiny20 also available in WLCSP package, this is a notable increase in specs, with a way more powerful CPU, 16 times as much RAM and 8-16 times the flash! Not to mention that it’s $1 a piece in QTY1, which is about what an ATTiny20 goes for. Being a 0.35mm pitch 16-pin BGA, your typical board house might not be quite happy with you, but once you get a board fabbed and delivered from a fab worth their salt, a bit of stenciling and reflow will get you to a devboard in no time.
Drawbacks? No English datasheet or Arduino port, and the 67-page PDF we found doesn’t have some things like register mappings. LILYGO promised that they will start selling the devboards soon, but we’re sure it wouldn’t be hard for us to develop our own. From there, we’d hope for an ESP8266-like effect – missing information pieced together, translated and made accessible, bit by bit.
When it comes to soldering such small packages, we highly recommend reflow. However, if you decide to go the magnet wire route, we wouldn’t dare object – just make sure to send us pictures. After all, seems like miniature microcontrollers like ATTiny20 are attractive enough of a proposition that people will pick the craziest route possible just to play with one. They say, the madness of the brave is the wisdom of life.
We thank [Cedric] for sharing this with us!
It’s said that the electronic devices we use on a daily basis, particularly cell phones, could be so much smaller than they are if only the humans they’re designed for weren’t so darn big and clumsy. That’s only part of the story — battery technology has a lot to do with overall device size — but it’s true that chips can be made a whole lot smaller than they are currently, and are starting to bump into the limit of being able to handle them without mechanical assistance.
Or perhaps not, if [mitxela]’s hand-soldering of a tiny ball-grid array chip is any guide. While soldering wires directly to a chip is certainly a practical skill and an impressive one at that, this at least dips its toe into the “just showing off” category. And we heartily endorse that. The chip is an ATtiny20 in a WLCSP (wafer-level chip-scale package) that’s a mere 1.5 mm by 1.4 mm. The underside of the chip has twelve tiny solder balls in a staggered 4×6 array with 0.4 mm pitch. [mitxela] tackled the job of soldering this chip to a 2.54-mm pitch breakout board using individual strands from #30 AWG stranded wire and a regular soldering iron, with a little Kapton tape to hold the chip down. Through the microscope, the iron tip looks enormous, and while we know the drop of solder on the tip was probably minuscule we still found ourselves mentally wiping it off as he worked his way across the array. In the end, all twelve connections were brought out to the protoboard, and the chip powers up successfully.
We’re used to seeing [mitxela] work at a much larger scale, like his servo-plucked music box or a portable Jacob’s Ladder. He’s been known to get small before though, too, like with these tiny blinkenlight earrings.
Continue reading “No Caffeine, No Problem: A Hand-Soldered Chip-Scale Package”
And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before? Neither had we. It means you get the silicon wafer without a plastic housing in order to save space in your design. Want to use that on a breadboard. You’re crazy!
Eh, that’s just a knee jerk reaction. The wafer-level isn’t that unorthodox as far as manufacturing goes. It’s something like chip on board electronics which have that black blob of epoxy sealing them after the connections are made. This image shows those connections which use magnet wire on a DIP breakout board. [Jason] used epoxy to glue the wafer down before grabbing his iron. It took 90 minutes to solder the nine connections, but his second attempt cut that process down to just 20. After a round of testing he used more epoxy to completely encase the chip and wires.
It works for parts with low pin-counts. But add one row/column and you’re talking about making sixteen perfect connections instead of just nine.