Taking a look at decapped ICs

Aside from wanting to play around with nitric acid, [Ben] really didn’t have a reason to decap a few 74xx and 4000-series logic chips. Not that we mind, as he provides a great tutorial at looking at a bare IC that isn’t covered in epoxy and resin.

Most ICs are encased in a hard epoxy shell making it very difficult to look at the circuits within. [Ben] tried to grind this epoxy off with a Dremel tool, but didn’t have much luck until he moved over to a CNC mill to remove 0.040 – 0.050″ of epoxy without breaking the bond wires.

After carving out a nice pocket above the die, [Ben] put a few drops of nitric acid on the chip to dissolve the epoxy coating.  This worked very slowly at room temperature, but after putting the chips on a hot plate the acid was able to reveal the die underneath.

After successfully removing all the epoxy and giving them an acetone bath, [Ben] took his chips over to the microscope and was able to check out the underlying circuit. He doesn’t have any idea what he could do with these decapped logic chips, but the bond wires are still intact so he could still use these chips in a build.

We’d like to see a few decapped MEMS devices, but if you have a suggestion on what [Ben] can do with his decapped chips, drop a note in the comments.

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Decapping integrated circuits with sap

[James] is interested in reverse engineering some integrated circuits. One of the biggest hurdles in this process has always been just getting to the guts of the chip. He used acetone to dissolve the plastic case but had trouble getting through the epoxy blob. Commonly, the epoxy is soaked in nitric acid for a few minutes but [James] didn’t have access to that chemical. Instead he popped into the local music store and picked up some rosin (used to make violin bows sticky enough to grab the strings of the instrument). After boiling down the rock-hard rosin and the chip for 20 minutes, he got a clean and relatively undamaged semiconductor that he can easily peer into.