Germanium diode

From Germanium To Diamond: The Many Shapes Of Semiconductors

It seems fair to say that semiconductor technology has been one of the most influential inventions in human history. Practically overnight it turned human technology from being large, cumbersome and power-hungry into an increasingly sleeker, more power-efficient and much more capable form. It has become practically impossible at this point to imagine modern society without semiconductor technology.

That said, we didn’t always use today’s silicon-based semiconductor technology, and although silicon-based semiconductors are exceedingly versatile and adaptable, they do have their limitations. The past years we have seen for example gallium-nitride semiconductors make big inroads in power switching technology, and more exotic forms like diamond-based semiconductors keep making their tantalizing appearances.

In this article we’ll take a look at how we ended up at silicon as the default for semiconductor technology, as well as why we may want to consider moving to other materials.

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Transforming A Tungsten Ditelluride Monolayer Into A Transistor

In the world of silicon semiconductors, the process of creating transistors and similar structures involves various rounds of modifications and additions in order to create the requisite functional layers. A less involved approach would simply create these structures in-situ, with research the past years having focused on transition-metal dichalcogenide (TMDC) monolayers to do exactly this. Recently [Seok Young Min] et al. reported (paywalled, Phys.org summary) on creating transistors in-situ in a tungsten ditelluride (WTe2) monolayer.

By selectively changing parts of the top layer into tungsten oxide (WOx) as an insulator and other sections into n-type WS2 and p-type WSe2 the researchers were able to create functional MOSFETs, without the normally requisite grafting on of different materials. An obvious advantage of this is that this can be done at an atomic scale, potentially achieving densities significantly higher than with industry standard silicon semiconductor technology.

WTe2 is not the only TMDC that could be viable here, of course, with other researchers investigating the use of MoSe2 for a similar purpose, as in this research by [N. Lu] et al. from 2014. This being the creation of 2D semiconductors, referring to the thin layers of these monolayer TMDCs, along with potentially other materials such as graphene.

Making Photovoltaic Solar Cells With A Microwave

Although solar panels may seem like a kind of magic, they’re really quite simple devices, in their silicon form featuring nothing but the p-type silicon wafer and an n-type layer doped with e.g. phosphorus. Because of this simplicity it’s quite possible to make your own solar cells at home using only a few basic, off-the-shelf ingredients and a kiln, which in this recent video by [Dr. Semiconductor] uses a microwave kiln and thus justifies the video’s title.

Even the silicon wafer that you start with can be easily purchased online, though you have to be careful that it’s a bare wafer, without existing etchings on it. On this you need to get a phosphorus-rich layer, which is done by creating a delicious mixture of 1 mL of tetraethyl orthosilicate (TEOS), 0.3 mL of 85 wt% phosphoric acid, 5 mL of ethanol and 0.25 mL of distilled water. After low heat boiling this for 30 minutes, it is spincoated onto the cut square of silicon wafer using a spinning platform, like a PC fan.

Next, you shove the coated silicon into the kiln and put it into the microwave to bake at a fairly low power level for half an hour. In the video it took less than 50% power of the microwave to not melt the silicon, so remember that those microwave kilns get pretty hot.

With the delightful smells of freshly baked silicon now teasing your nostrils, you can then take out the doped silicon to sand or etch off the thin layer of glass that’s formed around the new PV cell. On the clear spots you can now put a gallium-indium contact on the p-type Si side and a wad of indium on the newly doped Si-P side, which are now your contacts for the PV cell.

The full recipe along with many of the issues discussed in the video can also be found on the blog article, though the video conclusion notes that many improvements are still possible. The created PV cell in the video reaches an efficiency of about 5%, but this could be improved through changes like the use of a clean-room, adding an anti-reflection coating and improving the contact with the cell.

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Using Azo Photoisomerization To Alter Semiconductor Film Properties

Generally semiconductor devices like transistors have fixed properties, but using an azobenzene (Azo) compound it’s possible to optically alter these properties by exposing them to UV light. This is demonstrated in a recent paper by [Jaehoon Ji] et al., as published in Science Advances, with accompanying coverage by Princeton University.

Building on previous research on e.g. flakes of MoS2 with photochromic Azo molecules, a functional semiconductor device was created. This uses a transition metal dichalcogenide (TMD) monolayer combined with the Azo compound, with the latter altering the electrical and optical properties of the structure.

In both n- and p-type FET semiconductors it was demonstrated using visible and UV light that this can alter the carrier densities in the material, effectively altering the FET’s behavior.

While this is of course just a proof of concept, it does show that by using (Azo) molecules that can respond to certain electromagnetic radiation frequencies, electric fields, temperature, etc. semiconductor devices can be created whose behavior dynamically changes with these factors. This could potentially provide new ways to make programmable circuits and sensors.

Making RAM At Home In Your Own Semiconductor Fab

There’s little point in setting up your own shed-based clean room for semiconductor purposes if you don’t try to do something practical with it. Something like responding to the RAMpocalypse by trying to make your own RAM, for example.

Testing the DRAM cells. (Credit: Dr. Semiconductor, YouTube)
Testing the DRAM cells. (Credit: Dr. Semiconductor, YouTube)

After all, what could be so hard about etching the same repeating structures over and over? In a recent video, [Dr. Semiconductor]’s experience doing exactly this are detailed, with actual DRAM resulting at the end.

We covered the construction of the clean room shed previously, which should provide at least the basic conditions to produce semiconductors without worrying about contaminating dies. From here the process is reminiscent of etching PCBs, with a prepared surface coated with photoresist. Using UV exposure through a mask, the pattern is etched into the photoresist and from there the pattern is subsequently etched into the wafer’s surface.

With the patterns formed, the next step is doping of the silicon in order to create the active structures, i.e. the transistors and capacitors. Doping can be done in a variety of ways, with ion implantation being the industry standard method, but a bit too expensive and bulky for a shed fab. Instead a spin-on-glass method was used. After this the remaining functional structures can be built up.

If anyone was expecting to see a DDR5 DRAM die pop out at the end, they’re bound to be disappointed. The target here was to create a 5×4 array of DRAM cells, for a dizzying 20 bits. Still, the fact that it’s possible to DIY DRAM like this at home is already pretty awesome, with clearly plenty of room to push it towards and past fabrication nodes of the 1990s and beyond.

Although the produced DRAM cells have fairly leaky capacitors, they’re good enough for their purpose, and the plan is to scale up to a large DRAM array from here. Whether the DRAM control logic will also be implemented in hardware like this remains to be seen, but the video’s ending makes it clear that the goal is to attach it to a PC somehow.

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Lab-grown diamonds in 'cake' form -- before they are processed and polished.

Why Diamond Transistors Are So Hard To Make

Many things about diamonds seem eternal, including the many engineering problems related to making them work as a silicon replacement in semiconductor technology. Yet much like a diamond exposed to a stream of oxygen-rich air and a roughly 750°C heat source, time will eventually erase all of them. As detailed in a recent [Asianometry] video, over the decades the challenges with creating diamond wafers and finding the right way to dope pure diamond have been slowly solved, even if some challenges still remain today.

Diamond is basically the exact opposite as silicon when it comes to suitability as a semiconductor material, with a large bandgap (5.5 eV vs the 1.2 of silicon), and excellent thermal conductivity characteristics. This means that diamond transistors are very reliable, albeit harder to switch, and heat produced during switching is rapidly carried away instead of risking a meltdown as with silicon semiconductors.

Unlike silicon, however, diamond is much harder to turn into wafers as you cannot simply melt graphite and draw perfectly crystallized diamond out of said molten puddle. The journey of getting to the state-of-the art soon-to-be-4″ wafers grown on iridium alongside the current mosaic method is a good indication of the complete pain in the neck that just this challenge already is.

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I, Integrated Circuit

In 1958, the American free-market economist Leonard E Read published his famous essay I, Pencil, in which he made his point about the interconnected nature of free market economics by following everything, and we mean Everything, that went into the manufacture of the humble writing instrument.

I thought about the essay last week when I wrote a piece about a new Chinese microcontroller with an integrated driver for small motors, because a commenter asked me why I was featuring a non-American part. As a Brit I remarked that it would look a bit silly were I were to only feature parts made in dear old Blighty — yes, we do still make some semiconductors! — and it made more sense to feature cool parts wherever I found them. But it left me musing about the nature of semiconductors, and whether it’s possible for any of them to truly only come from one country. So here follows a much more functional I, Chip than Read’s original, trying to work out just where your integrated circuit really comes from. It almost certainly takes great liberties with the details of the processes involved, but the countries of manufacture and extraction are accurate. Continue reading “I, Integrated Circuit” →