All You Need To Know About I2S

April 18, 2019 by Jenny List 24 Comments

Last month we marked the 40th birthday of the CD, and it was as much an obituary as a celebration because those polycarbonate discs are fast becoming a rarity. There is one piece of technology from the CD age that is very much still with us though, and it lives on in the standard for sending serial digital audio between chips. The protocol is called I²S and comes as a hardware peripheral on many microcontrollers. It’s a surprisingly simple interface that’s quite easy to work with and thus quite hackable, so it’s worth a bit of further investigation.

It’s A Simple Enough Interface

Don’t confuse this with the other Philips Semiconductor protocol: I²C. Inter-Integrated Circuit protocol has the initials IIC, and the double letter was shortened to come up with the “eye-squared-see” nomenclature we’ve come to love from I²C. Brought to life in 1982, this predated I²S by four years which explains the somewhat strange abbreviation for “Inter-Integrated Circuit Sound”.

The protocol has stuck around because it’s very handy for dealing with the firehose of serial data associated with high-quality digital audio. It’s so handy that you’ve likely heard of it being used for other purposes than audio, which I’ll get to in a little bit. But first, what does I²S actually do?

Continue reading “All You Need To Know About I2S” →

How 5G Is Likely To Put Weather Forecasting At Risk

April 16, 2019 by Dan Maloney 90 Comments

If the great Samuel Clemens were alive today, he might modify the famous meteorological quip often attributed to him to read, “Everyone complains about weather forecasts, but I can’t for the life of me see why!” In his day, weather forecasting was as much guesswork as anything else, reading the clouds and the winds to see what was likely to happen in the next few hours, and being wrong as often as right. Telegraphy and better instrumentation made forecasting more scientific and improved accuracy steadily over the decades, to the point where we now enjoy 10-day forecasts that are at least good for planning purposes and three-day outlooks that are right about 90% of the time.

What made this increase in accuracy possible is supercomputers running sophisticated weather modeling software. But models are only as good as the raw data that they use as input, and increasingly that data comes from on high. A constellation of satellites with extremely sensitive sensors watches the planet, detecting changes in winds and water vapor in near real-time. But if the people tasked with running these systems are to be believed, the quality of that data faces a mortal threat from an unlikely foe: the rollout of 5G cellular networks.

Continue reading “How 5G Is Likely To Put Weather Forecasting At Risk” →

Nanoparticles Make Mega Difference For “Unweldable” Aluminum

April 15, 2019 by Kristina Panos 62 Comments

Though much of it is hidden from view, welding is a vital part of society. It’s the glue that holds together the framework of the cars we drive, the buildings we occupy, the appliances we use, and the heavy machinery that keeps us moving forward. Every year, the tireless search continues for stronger and lighter materials to streamline our journey into the future of transportation and space exploration.

Some of these futuristic materials have been around for decades, but the technology needed to weld them lagged behind. A group of researchers at UCLA’s Samueli School of Engineering recently found the key to unlocking the weldability of aluminium alloy 7075, which was developed in the 1940s. By adding titanium carbide nanoparticles to the mix, they were able to create a bond that proved to be stronger than the pieces themselves.

Continue reading “Nanoparticles Make Mega Difference For “Unweldable” Aluminum” →

Flip Chips And Sunken Ships: Packaging Trick For Faster, Smaller Semiconductors

April 11, 2019 by Ted Yapo 20 Comments

You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die is flipped upside down so the active surface is closest to the PCB. As opposed to the more traditional method in which the IC is face-up and connected to the packaging with bond wires, this allows for ultimate packaging efficiency and impressive performance gains. We hear a lot about advances in the integrated circuits themselves, but the packages that carry them and the issues they solve — and sometimes create — get less exposure.

Cutaway view of traditional wire-bond BGA package. Image CC-BY-SA 4.0 @TubeTimeUS

Let’s have a look at why semiconductor manufacturers decided to turn things on their head, and see how radioactive solder and ancient Roman shipwrecks fit in.

Continue reading “Flip Chips And Sunken Ships: Packaging Trick For Faster, Smaller Semiconductors” →

Es’hail-2: Hams Get Their First Geosynchronous Repeater

March 18, 2019 by Dan Maloney 27 Comments

In the radio business, getting the high ground is key to covering as much territory from as few installations as possible. Anything that has a high profile, from a big municipal water tank to a roadside billboard to a remote hilltop, will likely be bristling with antennas, and different services compete for the best spots to locate their antennas. Amateur radio clubs will be there too, looking for space to locate their repeaters, which allow hams to use low-power mobile and handheld radios to make contact over a vastly greater range than they could otherwise.

Now some hams have claimed the highest of high ground for their repeater: space. For the first time, an amateur radio repeater has gone to space aboard a geosynchronous satellite, giving hams the ability to link up over a third of the globe. It’s a huge development, and while it takes some effort to use this new space-based radio, it’s a game changer in the amateur radio community.

Continue reading “Es’hail-2: Hams Get Their First Geosynchronous Repeater” →

MCAS And The 737: When Small Changes Have Huge Consequences

March 14, 2019 by Tom Nardi 164 Comments

When the first 737 MAX entered service in May of 2017, it was considered a major milestone for Boeing. For nearly a decade, the aerospace giant had been working on a more fuel efficient iteration of the classic 737 that first took to the skies in 1967. Powered by cutting-edge CFM International LEAP engines, and sporting modern aerodynamic improvements such as unique split wingtips, Boeing built the new 737 to have an operating cost that was competitive with the latest designs from Airbus. With over 5,000 orders placed between the different 737 MAX variants, the aircraft was an instant success.

But now, in response to a pair of accidents which claimed 346 lives, the entire Boeing 737 MAX global fleet is grounded. While the investigations into these tragedies are still ongoing, the preliminary findings are too similar to ignore. In both cases, it appears the aircraft put itself into a dive despite the efforts of the crew to maintain altitude. While the Federal Aviation Administration initially hesitated to suspend operations of the Boeing 737 MAX, they eventually agreed with government regulatory bodies all over the world to call for a temporary ban on operating the planes until the cause of these accidents can be identified and resolved.

For their part, Boeing maintains their aircraft is safe. They say that grounding the fleet was done out of an “abundance of caution”, rather than in direct response to a particular deficiency of the aircraft:

Boeing continues to have full confidence in the safety of the 737 MAX. However, after consultation with the U.S. Federal Aviation Administration (FAA), the U.S. National Transportation Safety Board (NTSB), and aviation authorities and its customers around the world, Boeing has determined — out of an abundance of caution and in order to reassure the flying public of the aircraft’s safety — to recommend to the FAA the temporary suspension of operations of the entire global fleet of 371 737 MAX aircraft.

Until both accident investigations are completed, nobody can say with complete certainty what caused the loss of the aircraft and their passengers. But with the available information about what changes were made during the 737 redesign, along with Boeing’s own recommendations to operators, industry insiders have started to point towards a fault in the plane’s new Maneuvering Characteristics Augmentation System (MCAS) as a likely culprit in both accidents.

Despite the billions of dollars spent developing these incredibly complex aircraft, and the exceptionally stringent standards their operation is held to, there’s now a strong indication that the Boeing 737 MAX could be plagued with two common issues that we’ve likely all experienced in the past: a software glitch and poor documentation.

Continue reading “MCAS And The 737: When Small Changes Have Huge Consequences” →

Threading 3D Printed Parts: How To Use Heat-Set Inserts

February 28, 2019 by Sonya Vasquez 57 Comments

We can make our 3D-printed parts even more capable when we start mixing them with some essential “mechanical vitamins.” By combining prints with screws, nuts, fasteners, and pins, we get a rich ecosystem for mechanism-making with capabilities beyond what we could simply print alone.

Today I’d like to share some tips on one of my favorite functional 3D-printing techniques: adding heat-set inserts. As someone who’s been installing them into plastic parts for years manually, I think many guides overlook some process details crucial to getting consistent results.

Make no mistake; there are a handful of insert guides already out there [1, 2]. (In fact, I encourage you to look there first for a good jump-start.) Over the years though, I’ve added my own finishing move (nothing exotic or difficult) which I call the Plate-Press Technique that gives me a major boost in consistency.

Join me below as I fill in the knowledge gaps (and some literal ones too) to send you back to the lab equipped with a technique that will give you perfectly-seated inserts every time.

Continue reading “Threading 3D Printed Parts: How To Use Heat-Set Inserts” →