Reverse Engineering The Quansheng Hardware

April 23, 2024 by Dan Maloney 11 Comments

In the world of cheap amateur radio transceivers, the Quansheng UV-K5 can’t be beaten for hackability. But pretty much every hack we’ve seen so far focuses on the firmware. What about the hardware?

To answer that question, [mentalDetector] enlisted the help of a few compatriots and vivisected a UV-K5 to find out what makes it tick. The result is a complete hardware description of the radio, including schematics, PCB design files, and 3D renders. The radio was a malfunctioning unit that was donated by collaborator [Manuel], who desoldered all the components and measured which ones he could to determine specific values. The parts that resisted his investigations got bundled up along with the stripped PCB to [mentalDetector], who used a NanoVNA to characterize them as well as possible. Documentation was up to collaborator [Ludwich], who also made tweaks to the schematic as it developed.

PCB reverse engineering was pretty intense. The front and back of the PCB — rev 1.4, for those playing along at home — were carefully photographed before getting the sandpaper treatment to reveal the inner two layers. The result was a series of high-resolution photos that were aligned to show which traces connected to which components or vias, which led to the finished schematics. ~~There are still a few unknown components~~, The schematic has a few components crossed out, mostly capacitors by the look of it, representing unpopulated pads on the PCB.

Hats off to the team for the work here, which should make hardware hacks on the radio much easier. We’re looking forward to what’ll come from this effort. If you want to check out some of the firmware exploits that have already been accomplished on this radio, check out the Trojan Pong upgrade, or the possibilities of band expansion. We’ve also seen a mixed hardware-firmware upgrade that really shines.

3D Printing Aids Metal Polishing

September 20, 2022 by Jenny List 9 Comments

While a machinist can put a beautiful finish on a piece of metal with their lathe or mill, to achieve the ultimate finish, a further set of polishing procedures are necessary. Successively finer abrasives are used in a process called lapping, which removes as far as possible any imperfections and leaves eventually a mirrored smoothness. It’s not without problems though, particularly at the edge of a piece it can result in rounded-off corners as the abrasive rubs over them. [Adam the machinist] has a solution, and he’s found it with a 3D printer.

To avoid the rounded edges, the solution involves fitting a piece of metal or wood flush with the surface to be lapped, such that the pressure doesn’t act upon the corner. This can be inconvenient, and the solution avoids it by 3D printing a custom piece that fits over the entire machined object providing a flat surface surrounding the edges. We see it being used with a demonstration piece that has three separate surfaces in the same plane to lap,something that would have been challenging without the 3D printed aid.

Lapping isn’t a process we see too often here. But it has cropped up as an extreme overclocking technique.

Continue reading “3D Printing Aids Metal Polishing” →

Decapping Components Hack Chat With John McMaster

March 8, 2021 by Dan Maloney 2 Comments

Join us on Wednesday, March 10 at noon Pacific for the Decapping Components Hack Chat with John McMaster!

We treat them like black boxes, which they oftentimes are, but what lies beneath the inscrutable packages of electronic components is another world that begs exploration. But the sensitive and fragile silicon guts of these devices can be hard to get to, requiring destructive methods that, in the hands of a novice, more often than not lead to the demise of the good stuff inside.

To help us sort through the process of getting inside components, John McMaster will stop by the Hack Chat. You’ll probably recognize John’s work from Twitter and YouTube, or perhaps from his SiliconPr0n.org website, home to beauty shots of some of the chips he has decapped. John is also big in the reverse engineering community, organizing the Mountain View Reverse Engineering meetup, a group that meets regularly to discuss the secret world of components. Join us as we talk to John about some of the methods and materials used to get a look inside this world.

Our Hack Chats are live community events in the Hackaday.io Hack Chat group messaging. This week we’ll be sitting down on Wednesday, March 10 at 12:00 PM Pacific time. If time zones have you tied up, we have a handy time zone converter.

Click that speech bubble to the right, and you’ll be taken directly to the Hack Chat group on Hackaday.io. You don’t have to wait until Wednesday; join whenever you want and you can see what the community is talking about.
Continue reading “Decapping Components Hack Chat With John McMaster” →

Components Cut In Half Reveal Their Inner Beauty

April 2, 2019 by Dan Maloney 7 Comments

We rarely take a moment to consider the beauty of the components we use in electronic designs. Too often they are simply commodities, bought in bulk on reels or in bags, stashed in a drawer until they’re needed, and then unceremoniously soldered to a board. Granted, little scraps of black plastic with silver leads don’t exactly deserve paeans sung to their great beauty – at least not until you cut them in half to reveal the beauty within.

We’ve seen a little of what [Tube Time] has accomplished here; recall this lapped-down surface-mount inductor that [electronupdate] did a while back. The current work is more extensive and probably somewhat easier to accomplish because [TubeTime] focused mainly on larger through-hole components such as resistors and capacitors. It’s not clear how the sections were created, but it is clear that extreme care was taken to lap down the components with enough precision that the inner structures are clearly visible, and indeed, carefully enough that some, most notably the LED, still actually work. For our money, though, the best looking cross-sections are the capacitors, especially the electrolytic, for which [Tube Time] thoughtfully provides both radial and axial sections. The little inductor is pretty cool too. Some of the component diagrams are annotated, too, which makes for fascinating reading.

Honestly, we could look at stuff like this all day.

Thanks to [Stuart Rogers] for the tip.

Fail Of The Week: The Semiconductor Lapping Machine That Can’t Lap Straight

May 21, 2018 by Dan Maloney 34 Comments

It seemed like a good idea to build a semiconductor lapping machine from an old hard drive. But there’s just something a little off about [electronupdate]’s build, and we think the Hackaday community might be able to pitch in to help.

For those not into the anatomy and physiology of semiconductors, getting a look at the inside of the chip can reveal valuable information needed to reverse engineer a device, or it can just scratch the itch of curiosity. Lapping (the gentle grinding away of material) is one way to see the layers that make up the silicon die that lies beneath the epoxy. Hard drives designed to spin at 7200 rpm or more hardly seem a suitable spinning surface for a gentle lapping, but [electronupdate] just wanted the platter for its ultra-smooth, ultra-flat surface.

He removed the heads and replaced the original motor with a gear motor and controller to spin the platter at less than 5 rpm. A small holder for the decapped die was fashioned, and pinched between the platter hub and an idler. It gently rotates the die against the abrasive-covered platter as it slowly revolves. But the die wasn’t abrading evenly. He tried a number of different fixtures for the die, but never got to the degree of precision needed to see through the die layer by layer. We wonder if the weight of the die fixture is deflecting the platter a bit?

Failure is a great way to learn, if you can actually figure out where you went wrong. We look to the Hackaday community for some insight. Check out the video below and sound off in the comments if you’ve got any ideas.

Continue reading “Fail Of The Week: The Semiconductor Lapping Machine That Can’t Lap Straight” →

What Lies Within: SMT Inductor Teardown

May 24, 2017 by Dan Maloney 10 Comments

Ever wonder what’s inside a surface-mount inductor? Wonder no more as you watch this SMT inductor teardown video.

“Teardown” isn’t really accurate here, at least by the standard of [electronupdate]’s other component teardowns, like his looks inside LED light bulbs and das blinkenlights. “Rubdown” is more like it here, because what starts out as a rather solid looking SMT component needs to be ground down bit by bit to reveal the inner ferrite and copper goodness. [electronupdate] embedded the R30 SMT inductor in epoxy and hand lapped the whole thing until the windings were visible. Of course, just peeking inside is never enough, so he set upon an analysis of the inductor’s innards. Using a little careful macro photography and some simple image analysis, he verified the component’s data sheet claims; as an aside, is anyone else surprised that a tiny SMT component can handle 30 amps?

Looking for more practical applications for decapping components? How about iPhone brain surgery?

Continue reading “What Lies Within: SMT Inductor Teardown” →

Joe Grand Talks Deconstructing Circuit Boards

August 12, 2014 by Brian Benchoff 10 Comments

With the exception of [Eric Evenchick], the Hackaday crew are safely back from Defcon and not missing in the desert. This means we can really start rolling out all the stuff we saw this weekend, beginning with an interview with [Joe Grand], creator of the JTAGulator, early member of l0pht, and generally awesome dude.

The focus of [Joe]’s many talks this year was reverse engineering circuit boards. Most of these techniques involved fairly low-tech methods to peel apart circuit boards one layer at a time: sandpaper and milling machines are the simplest techniques, but [Joe] is also using some significantly more uncommon methods. Lapping machines get a mention, as do acoustic microscopy, CAT scans, and x-rays. [Joe]’s Defcon talk isn’t up on the intertubes yet, but his BSides talk about techniques that didn’t work is available.

In case you forgot, [Joe] is also a judge for a little contest we’re running, and we asked what he’s looking for in a truly spaceworthy entry. [Joe]’s looking for projects with a lot of effort put into them. Don’t get us wrong, project that require no effort can be extremely popular, but documentation is king. [Joe] thinks well documented projects are evidence project creators are building something because they want to build it, and not because they want to win a prize. That’s intrinsic motivation, kiddies. Learn it.