By Christian Taube - Own work, CC BY-SA 2.5, https://commons.wikimedia.org/w/index.php?curid=1503038

Tools Of The Trade – Through Hole Assembly

July 22, 2016 by Bob Baddeley 31 Comments

In our last installment of Tools of the Trade, we had just finished doing the inspection of the surface mount part of the PCB. Next in the process is the through hole components. Depending on the PCB, the order may change slightly, but generally it makes more sense to get all the SMT work done before moving to the through hole work.

Through hole used to be the standard, but as the need for size reduction and automation increased, SMT gained favor. However, there are still a lot of reasons to use through hole components, so they aren’t going away entirely (at least not any time soon). One of the biggest advantages of THT is mechanical strength, which makes it better suited for connectors than SMT. If you’ve ever popped a microusb connector off a PCB by breathing on it heavily, you’ll understand. So, how do we most efficiently get through hole components on a PCB, and how do the big boys do it?

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Bunnie And Snowden Explore IPhone’s Hackability

July 22, 2016 by Bob Baddeley 112 Comments

[Bunnie Huang] and [Edward Snowden] have teamed up to publish a paper exploring the possibility of introspection on the iPhone.

A rendering of the proposed introspection device attached to an iPhone6

The idea is that phones are increasingly complex and potentially vulnerable to all kinds of digital surveillance. Even airplane mode is insufficient for knowing that your phone isn’t somehow transmitting information. The paper looks at the various radios on the iPhone, going so far as opening up the device and reading signals at each of the chips for cell, WiFi, Bluetooth, GPS, and NFC to determine whether the chip itself is doing anything, regardless of what the screen says. This introspection can then be used to be confident that the phone is not communicating when it shouldn’t be.

The paper goes on to propose a device that they will prototype in the coming year which uses an FPC that goes into the phone through the SIM card port. It would contain a battery, display, buttons, multiple SIM cards, and an FPGA to monitor the various buses and chips and report on activity.

Significant hacking of an iPhone will still be required, but the idea is to increase transparency and be certain that your device is only doing what you want it to.

Tools Of The Trade – Inspection

June 29, 2016 by Bob Baddeley 15 Comments

In the last episode, we put our circuit boards through the reflow process. Unfortunately, it’s not 100% accurate, and there are often problems that can occur that need to be detected and fixed. That’s what the inspection step is for. One could insert an inspection step after paste, after placement, and after reflow, but the first two are icing on the cake — the phase where most mistakes can be caught is after reflow.

There are a number of problems typical with a surface mount reflow process: Continue reading “Tools Of The Trade – Inspection” →

Stay Scrappy, Hackers! Hardware Startups Versus Goliath

June 7, 2016 by Bob Baddeley 64 Comments

A toast to all the hackers out there who like to do it scrappy, who fight hard to get your products to work, who make your own tools and testing jigs and assembly lines in your basement, and who pound the pavement (and the keyboards) to get your product out there. Here’s to you (*clink*).

I had the fortune of a job interview recently in a big faceless company that you may have never heard of but probably use their stuff all the time. They make billions. And it was surreal. This article is about what it’s like for a scrappy start-up engineer to walk into the belly of the beast of an organization that counts its engineers in the tens of thousands. For obvious reasons, I can’t go into specific details, but let me paint for you in broad strokes what you, the hacker and entrepreneur, are up against.

When you have a company that’s been around for decades and whose yearly sales volume has more digits than some countries, everything is a few orders of magnitude bigger in scale. People, resources, volumes, everything.

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Tools Of The Trade – Reflow

June 2, 2016 by Bob Baddeley 40 Comments

In our previous issues in this series on making circuit boards, we covered placing solder paste and placing components. Now it’s time to bake our cake!

There are a variety of methods for reflowing a circuit board, but they all rely on a single principle: heat up the solder paste (a mixture of flux and solder) until the flux burns off and the solder becomes liquid, and then cool it down. Accomplishing this once or twice is easy; once you’ve played with a hot plate you’ll swear off through hole. Scaling it up and doing it repeatedly with high yield is extremely challenging, though. Continue reading “Tools Of The Trade – Reflow” →

Hack Your Apartment: Keyless Entry With Little Effort

May 26, 2016 by Bob Baddeley 50 Comments

A typical buzzer for an apartment complex.

If you’ve been to an apartment complex with a locked front door, you’ve seen the buzzer systems. You press the corresponding button for the apartment you want and can talk to the resident. They can press a button to unlock the door briefly, and then you go up to their apartment and they don’t have to come down to let you in. But what if you’re the resident and you want to go for a run without your keys jingling in your pocket? What if you want to open it using just your smartphone?

I knew this was a silly problem, and everyone I told about it thought that for the amount of time and effort it might save, it was hardly worth it.

Challenge accepted.

How fast can I put this together using only parts I have around the apartment? Turns out about 2 hours.

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3D Printing Metal In Mid Air

May 24, 2016 by Bob Baddeley 41 Comments

Published only 3 days before our article on how it is high time for direct metal 3D printers, the folks at Harvard have mastered 3D metal printing in midair with no support (as well as time travel apparently). Because it hardens so quickly, support isn’t necessary, and curves, sharp angles, and sophisticated shapes are possible.

The material is silver nanoparticles extruded out of a nozzle, and shortly after leaving it is blasted with a carefully programmed laser that solidifies the material. The trick is that the laser can’t focus on the tip of the nozzle or else heat transfer would solidify the ink inside the nozzle and clog it. In the video you can see the flash from the laser following slightly behind. The extrusion diameter is thinner than a hair, so don’t expect to be building large structures with this yet.

If you want big metal 3D printing, you should probably stick to the welders attached to robotic arms.

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