Visualizing Ionizing Radiation With DIY Plastic Scintillators

January 12, 2021 by Maya Posch 16 Comments

Although most types of radiation are invisible, except for the visible part of the EM spectrum, there are many ways that we can make various types of radiation visible. One of these methods is called ‘scintillation’, which can be used to make ionizing radiation visible. Recently [Lukas Springer] demonstrated how to make scintillators out of what is essentially plastic: bisphenol-A (E45, ‘epoxy’) resin with hardener and other additives.

The essential principle of operation behind a scintillator is its sensitivity to ionizing radiation, along with the tendency to absorb the energy and re-emit it in the form of light, i.e. luminescence. This is akin to the luminescence of LEDs, except that in their case the underlying principle is that of electro-luminescence. In the case of a plastic scintillator, the scintillating material is suspended in the solid polymer matrix base.

As [Lukas] points out, plastic scintillators are hardly ideal when it comes to their sensitivity to ionizing radiation, but they compensate for this by being easy to shape and produce, while being very durable. For this experiment, he used regular epoxy as the scintillator matrix, p-Terphenyl as primary scintillator and Coumarin 102 as the wavelength shifter. These three compounds act as a reaction chain, with the matrix absorbing the radiation and transferring it to the primary scintillator, which in turns emits the energy as light.

As the primary scintillator tends to radiate in the deep UV part of the EM spectrum, a wavelength shifter (i.e. secondary scintillator) which ‘shifts’ the emitted UV radiation into the visible part of the spectrum.

After producing a batch of plastic scintillators following the above recipe, [Lukas] irradiated them with gamma radiation, and found them to perform worse than some already not remarkable Russian PS-based scintillators. [Lukas’s] guess is that the matrix may be absorbing the primary scintillator’s output, or a mismatch between the primary and second scintillator.

While tricky to get right, it does seem like a fun hobby if one has some interesting in chemistry. [Lukas] (@GigaBecquerel on Twitter) provides a basic recipe as well as many other compounds to use for the primary and secondary scintillator, as well as the matrix compound. Enough to get started with.

Bare-Metal STM32: Universal, Asynchronous Communication With UARTs

January 8, 2021 by Maya Posch 5 Comments

One of the most basic and also most versatile communication interfaces on an MCU is the UART, or Universal Asynchronous Receiver/Transmitter. Usually found in the form of either a UART or USART, the former allows for pure asynchronous serial communication, whereas the latter adds flow control. When working with MCUs, they’re also one of the most common ways to output debug information.

While somewhat trickier to set up and use than a GPIO peripheral, the U(S)ART of ST’s STM32 families is fairly uncomplicated to use, and immediately provides one with an easy way to communicate in a bi-directional fashion with a device. In this article we’ll see what it takes to get started with basic UART communication on STM32 microcontrollers.

Continue reading “Bare-Metal STM32: Universal, Asynchronous Communication With UARTs” →

Powered Exoskeletons In Rough Terrain: An Interesting Aspect Of The Chang’e 5 Recovery Mission

January 6, 2021 by Maya Posch 20 Comments

At this point in time, one would be hard pressed to find anyone who is not at least aware of some of the uses of exoskeletons as they pertain to use by humans. From supporting people during rehabilitation, to ensuring that people working in industrial and warehouse settings do not overexert themselves, while also preventing injuries and increasing their ability to carry heavy loads without tiring.

During the recovery mission of the Chang’e 5 sample container in the rough terrain of Inner Mongolia, the crew which was tasked with setting up the communications center, electrical supply systems and other essential services in the area wore exoskeletons. Developed by a relatively new Chinese company called ULS Robotics (see embedded promotional video after the break), the powered exoskeletons allowed the crew to carry 50 kg loads at a time for a hundred meters across the rough, snowy terrain.

The obvious benefit of an exoskeleton here is that while humans are pretty good at navigating rough terrain, this ability quickly degrades the moment a heavy load is involved, as anyone who has done serious mountain trekking can probably attest to. By having the exoskeleton bear most of the load, the wearer can focus on staying upright and reaching the destination quickly and safely.

With the growing interest for exoskeletons from various industries, the military, as well as the elderly, it probably won’t be too long before we’ll be seeing more of them in daily life the coming years.

(Thanks, Qes)

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You Got Something On Your Processor Bus: The Joys Of Hacking ISA And PCI

January 6, 2021 by Maya Posch 32 Comments

Although the ability to expand a home computer with more RAM, storage and other features has been around for as long as home computers exist, it wasn’t until the IBM PC that the concept of a fully open and modular computer system became mainstream. Instead of being limited to a system configuration provided by the manufacturer and a few add-ons that really didn’t integrate well, the concept of expansion cards opened up whole industries as well as a big hobbyist market.

The first IBM PC had five 8-bit expansion slots that were connected directly to the 8088 CPU. With the IBM PC/AT these expansion slots became 16-bit courtesy of the 80286 CPU it was built around. These slots could be used for anything from graphics cards to networking, expanded memory or custom I/O. Though there was no distinct original name for this card edge interface, around the PC/AT era it got referred to as PC bus, as well as AT bus. The name Industry Standard Architecture (ISA) bus is a retronym created by PC clone makers.

With such openness came the ability to relatively easy and cheaply make your own cards for the ISA bus, and the subsequent and equally open PCI bus. To this day this openness allows for a vibrant ecosystem, whether one wishes to build a custom ISA or PCI soundcard, or add USB support to a 1981 IBM PC system.

But what does it take to get started with ISA or PCI expansion cards today? Continue reading “You Got Something On Your Processor Bus: The Joys Of Hacking ISA And PCI” →

Xolography: A Method To Improve The Accuracy Of Volumetric 3D Printing

January 4, 2021 by Maya Posch 7 Comments

Over the past years, additive manufacturing (AM) has become a common tool for hackers and makers, with first FDM and now SLA 3D printers becoming affordable for the masses. While these machines are incredibly useful, they utilize a slow layer-by-layer approach to produce objects. A relatively new technology called Volumetric Additive Manufacturing (VAM) promises to change all that by printing the entire object in one go, and according to a recent article in Nature, it just got a big resolution boost.

The concept is similar to SLA printing, but instead of curing the resin by projecting a 2D image of the current layer into the container, VAM uses multiple lasers to create intersecting points within the liquid. After exposing the resin to this projection for several seconds, the 3D model is built all at once. Not only is this far faster, but it removes the need for support materials and even a traditional build plate is unnecessary.

Visualization of the dual-color printing process as used by Regehly et al. (Credit: Nature)

Up till now the resolution and maximum object size of VAM has left a lot to be desired, but in this new research by Regehly et al. claim to have accomplished a feature resolution of ‘up to 25 micrometers’ and a solidification rate of ‘up to 55 cm³/s’. They used two crossing laser beams of different wavelengths, one to form the ‘light sheet’ (blue in the graphic) and a second beam (in red) to project the slide onto this light sheet. They refer to this technique as ‘xolography’, as a mesh-up of ‘holo’ (Greek for ‘whole’) and the ‘X’ shape formed by the crossing laser beams.

Key to making this work is the chemistry of the resin: the first wavelength excites the molecules called DCPI (Dual-Color Photo Initiators) that are dissolved in the resin. The second wavelength when hitting the same molecules initiates the resin polymerization process. The object pictured at the top of the page was a test print; producing such a design on a traditional 3D printer would have required a considerable amount of difficult to remove support material.

While this is obviously not a technology hobbyists will be using to replace their FDM and SLA printers with any time soon, there are still many companies and institutes working on various VAM technologies and approaches. As more and more of the complexities and challenges are dealt with, who knows when VAM may become a viable replacement for at least some SLA applications?

Thanks to [Qes] for the tip.

How A Quadriplegic Patient Was Able To Eat By Himself Again Using Artificial Limbs

January 2, 2021 by Maya Posch 9 Comments

Thirty years ago, [Robert “Buz” Chmielewski] suffered a surfing accident as a teenager. This left him as a quadriplegic due to a C6 spinal cord injury. After becoming a participant in a brain-computer interface study at Johns Hopkins, he was recently able to feed himself through the use of prosthetic arms. The most remarkable thing about these prosthetic arms is primarily the neural link with [Buz’s] brain, which allows him to not only control the artificial arms, but also feel what they are touching, due to a closed-loop system which transfers limb sensory input to the patient’s brain.

The prosthetic limb in question is the Modular Prosthetic Limb (MPL) from Johns Hopkins Applied Physics Laboratory (APL). The Johns Hopkins Medicine Brain-Computer Interface study began a year ago, when [Buz] had six microelectrode arrays (MEA) implanted into his brain: half in the motor cortex and half in the sensory cortex. During the following months, the study focused on using the signals from the first set of arrays to control actuators, such as the MPL. The second set of arrays was used to study how the sensory cortex had to be stimulated to allow a patient to feel the artificial limb much as one feels a biological limb.

What makes this study so interesting is not only the closed-loop approach which provides the patient with feedback on the position and pressure on the prosthetic, but also that it involves both hemispheres of the brain. As a result, after only a year of the study, [Buz] was able to use two of the MPLs simultaneously to feed himself, which is a delicate and complicated tasks.

In the video embedded after the break one can see a comparison of [Buz] at the beginning of the study and today, as he manages to handle cutlery and eat cake, without assistance.

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Magnetocuring: Curing Epoxy With A Magnetic Field

December 30, 2020 by Maya Posch 20 Comments

Who doesn’t love epoxy? Epoxy resins, also known as polyepoxides, are an essential adhesive in many applications, both industrially and at smaller scales. Many polyepoxides however require the application of heat (around 150 °C for most types) in order to cure (harden), which can be complicated when the resin is applied to or inside layers of temperature sensitive materials. Now researchers at Nanyang Technological University (NTU) in Singapore have found a way to heat up resins using an alternating magnetic field (PDF), so-called magnetocuring.

As detailed in the research article by R. Chaudhary et al., they used commercially available epoxy resin and added nano particles of a Mn_xZn_1-xFe₂O₄ alloy. This mixture was exposed to an alternating magnetic field to induce currents in the nano particles and subsequently produce heat that served to raise the temperature of the surrounding resin to about 160 °C in five minutes, allowing the resin to cure. There is no risk of overheating, as the nano particles are engineered to reach their Curie temperature, at which point the magnetic field no longer affects them. The exact Curie temperature was tweaked by changing the amount of manganese and zinc in the alloy.

After trying out a number of different alloy formulations, they settled on Mn_0.7Zn_0.3Fe₂O₄ as the optimal formulation at which no resin scorching occurred. As with all research it’s hard to tell when (and if) it will make it into commercial applications, but if this type of technology works out we could soon be gluing parts together using epoxy resin and an EM field instead of fumbling with the joys of two-component epoxy.

(Thanks, Qes)