Quite a few hackers nowadays share their tips and tricks on Twitter – it’s easy to do so, and provided either an existing audience or a bit of effort to get one, you’ll get at least a few notifications telling you that people appreciated what you had to share. Today, we’re covering two desoldering hacks highlighted there that will be useful some day, exactly when you need them. Both of them use a piece of wire and, in a way, extend the reach of your soldering iron’s tip. Copper wire would work better because of superior thermal conductivity, but other types of solid core wire will work in a pinch.
First hack is brought to us by [Erin Rose] – desoldering a microUSB socket. You need to heat up the entire shield and the pins at the same time, which the wire acts as a thermal gateway for. As long as there are melted solder bridges from sections of the wire to all the copper-to-part connection points, it should be easy to pump enough heat into the solder joints for all of them to eventually melt and give in at once.
Second hack is brought to us by [arturo182]. A piece of thick wire acts, again, as a heat conductor to desolder a 0.5mm pitch TQFP-100 package IC. You have to bend the wire into a correct shape, so that it’s as close to the pins of the TQFP as possible. In this situation, the wire performs two functions: first, transferring the heat from the iron’s tip to different points along the wire, then, as a barrier that helps solder not escape too far away from the pins. Copious amounts of flux likely desired for this one!
Hopefully, this comes handy if you ever need to replace an all-SMD part ASAP but don’t have a hot air gun or a hotplate handy. After getting this concept down to an art, we are sure you won’t limit yourself to TQFP parts and MicroUSB sockets. We’ve talked about desoldering practices before as part of our newsletter, and using lots of melted solder for part removal is not a foreign concept to us, either.