Laptop GPU Upgrade With Just A Little Reballing

October 2, 2024 by Arya Voronova 5 Comments

Modern gaming laptops are in an uncomfortable spot – often too underpowered for newest titles, but too bulky to be genuinely portable. It doesn’t help they’re not often upgradeable, so you’re stuck with what you’ve bought – unless, say, you’re a hacker equipped some tools for PCB reflow? If that’s the case, welcome to [TechModLab]’s video showing you the process of upgrading a laptop’s soldered-on NVIDIA GPU, replacing the 3070 chip with a 3080.

You don’t need much – the most exotic tool is a BGA rework station, holding the mainboard steady&stiff and heating a specific large chip on the board with an infrared lamp from above. This one is definitely a specialty tool, but we’ve seen hackers build their own. From there, some general soldering tools like flux and solder wick, a stencil for your chip, BGA balls, and a $20 USB-C hotplate are instrumental for reballing chips – tools you ought to have.

Reballing was perhaps the hardest step of the journey – instrumental for preparing the GPU before the transplant. Afterwards, only a few steps were needed – poking a BGA ball that didn’t connect, changing board straps to adjust for the new VRAM our enterprising hacker added alongside the upgrade, and playing with the driver process install a little. Use this method to upgrade from a lower-end binned GPU you’re stuck with, or perhaps to repair your laptop if artifacts start appearing – it’s a worthwhile reminder about methods that laptop repair shops use on the daily.

Itching to learn more about BGAs? You absolutely should read this article series by our own [Robin Kearey]. We’ve mostly seen reballing used for upgrading RAM on laptop and Raspberry Pi boards, but seeing it being used for an entire laptop is nice – it’s the same technique, just scaled up, and you always can start by practicing at a smaller scale. Now, it might feel like we’ve left the era of upgradable GPUs on laptops, and today’s project might not necessarily help your worries – but the Framework 16 definitely bucks the trend.

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Soldering, Up Close And Personal

September 14, 2024 by Dan Maloney 13 Comments

A word of warning before watching this very cool video on soldering: it may make you greatly desire what appears to be a very, very expensive microscope. You’ve been warned.

Granted, most people don’t really need to get this up close and personal with their soldering, but as [Robert Feranec] points out, a close look at what’s going on when the solder melts and the flux flows can be a real eye-opener. The video starts with what might be the most esoteric soldering situation — a ball-grid array (BGA) chip. It also happens to be one of the hardest techniques to assess visually, both during reflow and afterward to check the quality of your work. While the microscope [Robert] uses, a Keyence VHX-7000 series digital scope, allows the objective to swivel around and over the subject in multiple axes and keep track of where it is while doing it, it falls short of being the X-ray vision you’d need to see much beyond the outermost rows of balls. But, being able to look in at an angle is a huge benefit, one that allows us a glimpse of the reflow process.

More after the break

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Tiny Prisms Let You See What Lies Beneath A BGA Chip

May 1, 2024 by Dan Maloney 16 Comments

Compared to through-hole construction, inspecting SMD construction is a whole other game. Things you thought were small before are almost invisible now, and making sure solder got where it’s supposed to go can be a real chore. Add some ball grid array (BGA) chips into the mix, where the solder joints are not visible by design, and inspection is more a leap of faith than objective proof of results.

Unless, of course, you put the power of optics to work, as [Petteri Aimonen] does with this clever BGA inspection tool. It relies on a pair of tiny prisms to bounce light under one side of a BGA chip and back up the other. The prisms are made from thin sheets of acrylic; [Petteri] didn’t have any 1-mm acrylic sheet on hand, so he harvested material from a razor blade package. The edge of each piece was ground to a 45-degree angle and polished with successively finer grits until the surfaces were highly reflective. One prism was affixed to a small scrap of PCB with eleven SMD LEDs in a row, forming a light pipe that turns the light through 90 degrees. The light source is held along one edge of a BGA, shining light underneath to the other prism, bouncing light through the forest of solder balls and back toward the observer.

The results aren’t exactly crystal clear, which is understandable given the expedient nature of the materials and construction employed. But it’s certainly more than enough to see any gross problems lying below a BGA, like shorts or insufficiently melted solder. [Petteri] reports that flux can be a problem, too, as excess of the stuff can crystalize between pads under the BGA and obstruct the light. A little extra cleaning should help in such cases.

Haven’t tackled a BGA job yet? You might want to get up to speed on that.

The FPC adapter shown soldered between the BGA chip and the phone's mainboard, with the phone shown to have successfully booted, displaying an unlock prompt on the screen

IPhone 6S NVMe Chip Tapped Using A Flexible PCB

March 3, 2024 by Arya Voronova 3 Comments

Psst! Hey kid! Want to reverse-engineer some iPhones? Well, did you know that modern iPhones use PCIe, and specifically, NVMe for their storage chips? And if so, have you ever wondered about sniffing those communications? Wonder no more, as this research team shows us how they tapped them with a flexible printed circuit (FPC) BGA interposer on an iPhone 6S, the first iPhone to use NVMe-based storage.

The research was done by [Mohamed Amine Khelif], [Jordane Lorandel], and [Olivier Romain], and it shows us all the nitty-gritty of getting at the NVMe chip — provided you’re comfortable with BGA soldering and perhaps got an X-ray machine handy to check for mistakes. As research progressed, they’ve successfully removed the memory chip dealing with underfill and BGA soldering nuances, and added an 1:1 interposer FR4 board for the first test, that proved to be successful. Then, they made an FPC interposer that also taps into the signal and data pins, soldered the flash chip on top of it, successfully booted the iPhone 6S, and scoped the data lines for us to see.

This is looking like the beginnings of a fun platform for iOS or iPhone hardware reverse-engineering, and we’re waiting for further results with bated breath! This team of researchers in particular is prolific, having already been poking at things like MITM attacks on I2C and PCIe, as well as IoT device and smartphone security research. We haven’t seen any Eagle CAD files for the interposers published, but thankfully, most of the know-how is about the soldering technique, and the paper describes plenty. Want to learn more about these chips? We’ve covered a different hacker taking a stab at reusing them before. Or perhaps, would you like to know NVMe in more depth? If so, we’ve got just the article for you.

We thank [FedX] for sharing this with us on the Hackaday Discord server!

The Tale Of The Final EVGA GPU Overclocking Record

January 23, 2023 by Dave Rowntree 12 Comments

It’s not news that EVGA is getting out of the GPU card game, after a ‘little falling out’ with Nvidia. It’s sad news nonetheless, as this enthusiastic band of hardware hackers has a solid following in certain overclocking and custom PC circles. The Games Nexus gang decided to fly over to meet up with the EVGA team in Zhonghe, Taiwan, and follow them around a bit as they tried for one last overclocking record on the latest (unreleased, GTX4090-based) GPU card. As you will note early on in the video, things didn’t go smoothly, with their hand-lapped GPU burning out the PCB after a small setup error. Continue reading “The Tale Of The Final EVGA GPU Overclocking Record” →

The SSD described, a green board with a ZIP connector, a controller chip and two out of four NAND chips populated. There's traces of flux on the chip, as it hasn't been washed after soldering yet.

ZIF HDDs Dying Out? Here’s An Open-Source 1.8″ SSD

October 30, 2022 by Arya Voronova 14 Comments

A lot of old technology runs on parts no longer produced – HDDs happen to be one such part, with IDE drives specifically being long out of vogue, and going extinct to natural causes. There’s substitutes, but quite a few of them are either wonky or require expensive storage medium. Now, [dosdude1] has turned his attention to 1.8 ZIF IDE SSDs – FFC-connected hard drives that are particularly rare and therefore expensive to replace, found in laptops like the Macbook Air 1,1 2008 model. Unsatisfied with substitutes, he’s designed an entire SSD from the ground up around an IDE SSD controller and NAND chips. Then, he made the design open-source and filmed an assembly video so that we can build our own. Take a look, we’ve put it below the break!

For an open-source design, there’s a respectable amount of work shared with us. He’s reverse-engineered some IDE SSDs based on the SM2236 controller to design the schematic, and put the full KiCad files on GitHub. In the video, he shows us how to assemble this SSD using only a hot air station and a soldering iron, talks about NAND matching and programming software intricacies, and shows the SSD working in the aforementioned Macbook Air. Certainly, assembly would have been faster and easier with a stencil, but the tools used work great for what’s a self-assembly tutorial!

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Working With BGAs: Design And Layout

June 20, 2022 by Robin Kearey 26 Comments

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder balls. Still, many hobbyists prefer to stay with QFP and QFN packages because they’re easier to solder. While that is a fair point, BGA packages can offer significant space savings, and are sometimes the only choice: with the ongoing chip shortage, some other package versions might simply be unavailable. Even soldering doesn’t have to be complicated: if you’re already comfortable with solder paste and reflow profiles, adding a BGA or two into the mix is pretty easy.

In this article we’ll show that working with BGA chips is not as difficult as it may seem. The focus will be on printed circuit board design: how to draw proper footprints, how to route lots of signals and what capabilities your PCB manufacturer should have. We’ll cover soldering and rework techniques in a future article, but first let’s take a look at why BGAs are used at all.

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