For most of human history, our inventions and innovations have been at a scale that’s literally easy to grasp. From the largest cathedral to the finest pocket watch, everything that went into our constructions has been something we could see with our own eyes and manipulate with our hands. But in the middle of the 20th century, we started making really, really small stuff: semiconductors. For the first time, we were able to create mechanisms too small to be seen with the naked eye, and too fine to handle with our comparatively huge hands. We needed a way to scale these devices up somewhat to make them useful parts. In short, they needed to be packaged.
We know that the first commercially important integrated circuits were packaged in the now-familiar dual in-line package (DIP), the little black plastic millipedes that would crawl across circuit boards for the next 50 years. As useful and versatile as the DIP was, and for as successful as the package became, its design was anything but obvious. Let’s take a look at the dual in-line package and how it got that way.
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Fresh from the factory Dual Inline Package (DIP) chips come with their legs splayed every so slightly apart — enough to not fit into the carefully designed footprints on a circuit board. You may be used to imprecisely bending them by hand on the surface of the bench. [Marco] is more refined and shows off a neat little spring loaded tool that just takes a couple of squeezes to neatly bend both sides of the DIP, leaving every leg the perfect angle. Shown here is 
Another tool which caught our eye is the one he uses for bending the metal film resistor leads: the “Biegelehre” or lead bending tool. You can see that [Marco’s] tool has an angled trench to account for different resistor body widths, with stepped edges for standard PCB footprint spacing. We bet you frequently use the same resistor bodies so 3D printing is made easier by 
