It is now six decades since the first prototypes of practical integrated circuits were produced. We are used to other technological inventions from the 1950s having passed down the food chain to the point at which they no longer require the budget of a huge company or a national government to achieve, but somehow producing an integrated circuit has remained out of reach. It’s the preserve of the Big Boys, move on, there’s nothing to see here.
Happily for us there exists a dedicated band of experimenters keen to break that six-decade dearth of home-made ICs. And now one of them, [Sam Zeloof], has made an announcement on Twitter that he has succeeded in making a dual differential amplifier IC using a fully lithographic process in his lab. We’ve seen [Jeri Ellsworth] create transistors and integrated circuits a few years ago and he is at pains to credit her work, but her interconnects were not created lithographically, instead being created with conductive epoxy.
For now, all we have is a Twitter announcement, a promise of a write-up to come, and full details of the lead-up to this momentous event on [Sam]’s blog. He describes both UV lithography using a converted DLP projector and electron beam lithography using his electron microscope, as well as sputtering to deposit aluminium for on-chip interconnects. We’ve had an eye on his work for a while, though his progress has been impressively quick given that he only started amassing everything in 2016. We look forward to greater things from this particular garage.









Some solutions come from no more than looking at two dissimilar things while in the right mindset, and realizing they can be mashed together. In this case I had recently segmented a large, hollow, 3D model into smaller 3D-printer-sized pieces and printed them all out, but found myself with a problem. I now had a large number of curved, thin-walled pieces that needed to be connected flush with one another. These were essentially butt joints on all sides — the weakest kind of joint — offering very little surface for gluing. On top of it all, the curved surfaces meant clamping was impractical, and any movement of the pieces while gluing would result in other pieces not lining up.