Threading 3D Printed Parts: How To Use Heat-Set Inserts

We can make our 3D-printed parts even more capable when we start mixing them with some essential “mechanical vitamins.” By combining prints with screws, nuts, fasteners, and pins, we get a rich ecosystem for mechanism-making with capabilities beyond what we could simply print alone.

Today I’d like to share some tips on one of my favorite functional 3D-printing techniques: adding heat-set inserts. As someone who’s been installing them into plastic parts for years manually, I think many guides overlook some process details crucial to getting consistent results.

Make no mistake; there are a handful of insert guides already out there [1, 2]. (In fact, I encourage you to look there first for a good jump-start.) Over the years though, I’ve added my own finishing move (nothing exotic or difficult) which I call the Plate-Press Technique that gives me a major boost in consistency.

Join me below as I fill in the knowledge gaps (and some literal ones too) to send you back to the lab equipped with a technique that will give you perfectly-seated inserts every time.

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Security Engineering: Inside The Scooter Startups

A year ago, ridesharing scooter startups were gearing up for launch. Workers at Bird, Lime, Skip, and Spin were busy improving their app, retrofitting scooters, and most importantly, figuring out the logistics of distributing thousands of electronic scooters along the sidewalks of the Bay Area. These companies were gearing up for a launch in early summer, but one company — nobody can remember exactly who — decided to launch early. First mover advantage, and all. Overnight, these scooter companies burst into overdrive, chucking scooters out of panel vans onto the sidewalk simply to keep up with the competition.

The thing about San Francisco, and California in general, is that it’s a very direct democracy masquerading as a representative government. Yes, there are city council members and a state legislature, but the will of the people will rule. No one liked tripping over the scooters littering the sidewalks, so the scooters ended up at the bottom of a lake. Or in trees. Or in the trash. In time, city permits were issued, just like a hot dog cart or any other business operating on a public sidewalk, and the piles of electric scooters disappeared. Not before hundreds of scooters were vandalized, that is.

It’s still early in the electric scooter rental startup space, but if there’s one company leading the pack, It’s Bird. they’re getting the most press, the CEO was formerly at Lyft and Uber (which explains the press), and they’ve raised nearly a half Billion dollars in funding (which explains the press). Bird is valued at two Billion dollars, and it’s one of four major ridesharing scooter startups. Pets.com had nothing on this.

Despite how overvalued you think a scooter startup might be, they’re still a business, and they’re ruled by the bottom line. Bird has grown a lot in the past year, and with that comes engineering challenges. The Bird scooters must be more resistant to vandalism. The Bird scooters must be harder to steal. Above all else, they must remain in service longer. This is the teardown of how Bird managed to improve their bottom line and engineer a better scooter.

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Video: Putting High Speed PCB Design To The Test

Designing circuit boards for high speed applications requires special considerations. This you already know, but what exactly do you need to do differently from common board layout? Building on where I left off discussing impedance in 2 layer Printed Circuit Board (PCB) designs, I wanted to start talking about high speed design techniques as they relate to PCBs.  This is the world of multi-layer PCBs and where the impedance of both the Power Delivery Network (PDN) and the integrity of the signals themselves (Signal Integrity or SI) become very important factors.

I put together a few board designs to test out different situations that affect high speed signals. You’ve likely heard of vias and traces laid out at right angles having an impact. But have you considered how the glass fabric weave in the board itself impacts a design? In this video I grabbed some of my fanciest test equipment and put these design assumptions to the test. Have a look and then join me after the break for more details on what went into this!

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Oreo Construction: Hiding Your Components Inside The PCB

In recent months, the ability to hide components inside a circuit board has become an item of interest. We could trace this to the burgeoning badgelife movement, where engineers create beautiful works of electronic art. We can also attribute this interest to Bloomberg’s Big Hack, where Jordan Robertson and Michael Riley asserted Apple was the target of Chinese spying using components embedded inside a motherboard. The Big Hack story had legs, but so far no evidence of this hack’s existence has come to light, and the companies and governments involved have all issued denials that anything like this exists.

That said, embedding components inside a PCB is an interesting topic of discussion, and thanks to the dropping prices of PCB fabrication (this entire project cost $15 for the circuit boards), it’s now possible for hobbyists to experiment with the technique.

But first, it’s important to define what ‘stuffing components inside a piece of fiberglass’ is actually called. My research keeps coming back to the term ’embedded components’ which is utterly ungooglable, and a truly terrible name because ’embedded’ means something else entirely. You cannot call a PCB fabrication technique ’embedded components’ and expect people to find it on the Internet. For lack of a better term, I’m calling this ‘Oreo construction’, because of my predilection towards ‘stuf’, and because it needs to be called something. We’re all calling it ‘Oreo construction’ now, because the stuf is in the middle. This is how you do it with standard PCB design tools and cheap Chinese board houses.

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Sharpest Color CRT Display Is Monochrome Plus A Trick

I recently came across the most peculiar way to make a color CRT monitor. More than a few oscilloscopes have found their way on to my bench over the years, but I was particularly struck with a find from eBay. A quick look at the display reveals something a little alien. The sharpness is fantastic: each pixel is a perfect, uniform-colored little dot, a feat unequaled even by today’s best LCDs. The designers seem to have chosen a somewhat odd set of pastels for the UI though, and if you move your head just right, you can catch flashes of pure red, green, and blue. It turns out, this Tektronix TDS-754D sports a very peculiar display technology called NuColor — an evolutionary dead-end that was once touted as a superior alternative to traditional color CRTs.

Join me for a look inside to figure out what’s different from those old, heavy TVs that have gone the way of the dodo.

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Scramjet Engines On The Long Road To Mach 5

When Charles “Chuck” Yeager reached a speed of Mach 1.06 while flying the Bell X-1 Glamorous Glennis in 1947, he became the first man to fly faster than the speed of sound in controlled level flight. Specifying that he reached supersonic speed “in controlled level flight” might seem superfluous, but it’s actually a very important distinction. There had been several unconfirmed claims that aircraft had hit or even exceeded Mach 1 during the Second World War, but it had always been during a steep dive and generally resulted in the loss of the aircraft and its pilot. Yeager’s accomplishment wasn’t just going faster than sound, but doing it in a controlled and sustained flight that ended with a safe landing.

Chuck Yeager and his Bell X-1

In that way, the current status of hypersonic flight is not entirely unlike that of supersonic flight prior to 1947. We have missiles which travel at or above Mach 5, the start of the hypersonic regime, and spacecraft returning from orbit such as the Space Shuttle can attain speeds as high as Mach 25 while diving through the atmosphere. But neither example meets that same requirement of “controlled level flight” that Yeager achieved 72 years ago. Until a vehicle can accelerate up to Mach 5, sustain that speed for a useful period of time, and then land intact (with or without a human occupant), we can’t say that we’ve truly mastered hypersonic flight.

So why, nearly a century after we broke the sound barrier, are we still without practical hypersonic aircraft? One of the biggest issues historically has been the material the vehicle is made out of. The Lockheed SR-71 “Blackbird” struggled with the intense heat generated by flying at Mach 3, which ultimately required it to be constructed from an expensive and temperamental combination of titanium and polymer composites. A craft which flies at Mach 5 or beyond is subjected to even harsher conditions, and it has taken decades for material science to rise to the challenge.

With modern composites and the benefit of advanced computer simulations, we’re closing in on solving the physical aspects of surviving sustained hypersonic flight. With the recent announcement that Russia has put their Avangard hypersonic glider into production, small scale vehicles traveling at high Mach numbers for extended periods of time are now a reality. Saying it’s a solved problem isn’t quite accurate; the American hypersonic glider program has been plagued with issues related to the vehicle coming apart under the stress of Mach 20 flight, which heats the craft’s surface to temperatures in excess of 1,900 C (~3,500 F). But we’re getting closer, and it’s no longer the insurmountable problem it seemed a few decades ago.

Today, the biggest remaining challenge is propelling a hypersonic vehicle in level flight for a useful period of time. The most promising solution is the scramjet, an engine that relies on the speed of the vehicle itself to compress incoming air for combustion. They’re mechanically very simple, and the physics behind it have been known since about the time Yeager was climbing into the cockpit of the X-1. Unfortunately the road towards constructing, much less testing, a full scale hypersonic scramjet aircraft has been a long and hard one.

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Finding The Goldilocks Cell Module

If adding a cell modem is dealing with a drama queen of a hardware component, then choosing from among the many types of modules available turns the designer into an electronics Goldilocks. There are endless options for packaging and features all designed to make your life easier (or not!) so you-the-designer needs to have a clear understanding of the forces at work to come to a reasonable decision. How else will Widget D’lux® finally ship? You are still working on Widget D’lux®, aren’t you?

OK, quick recap from last time. Cell modems can be used to add that great feature known as The Internet to your product, which is a necessary part of the Internet of Things, and thus Good. So you’re adding a cell modem! But “adding a cell modem” can mean almost anything. Are you aiming to be Qualcomm and sue Apple build modems from scratch? Probably not. What about sticking a Particle Electron inside to bolt something together quickly? Or talk to Telit and put a bare modem on a board? Unless you’re expecting to need extremely high volume and have a healthy appetite for certification glee, I bet you’ve chosen to get a modem with as many existing certifications as possible, which takes us to where we are today. Go read the previous post if you want a much more elaborate discussion of your modem-packaging options and some of the trade offs involved. Continue reading “Finding The Goldilocks Cell Module”